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Oct 23rd, 2012
Yole Développement presents its latest 3D TSV market trends analysis at the Asia Technology Forum, powered by SUSS MicroTec
Yole Développement supports the Asia Technology Forum powered by SUSS MicroTec. Yole Développement’s Taiwan CTO, Pascal Viaud moderates this event and presents the latest analysis in the field of Advanced Packaging. For further information & registration, please visit SUSS MicroTec website: www.suss.com, Upcoming Event section.
Next month, SUSS MicroTec invites you to the Asia Technology Forum covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations:
SUSS MicroTec’s forum features speakers from industry leading companies and world-renowned research institutions.
List of speakers: Brewer Science, Fraunhofer IZM Berlin, GenISys, HD MicroSystems, Industrial Technology Research Institute, PVA TePla, Shanghai Institute of Microsystem and Information Technology, STATS ChipPAC, SUSS MicroTec and Yole Développement.
Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts. SUSS MicroTec and partners look forward to welcoming you!
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