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Sep 18th, 2012
Yole Développement profiles 350+ power electronics semiconductor manufacturers worldwide
Yole Développement announces its Power Fabs Database.
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In this database, Yole Développement provides the most comprehensive information about worldwide manufacturers with production type, status and capacity. Also, it includes graphs and analysis of the power fab landscape.

Get the real picture of today power electronics manufacturing…
Yole Développement’s power fab database is a unique tool that provides a complete overview of all the power electronics manufacturers in the world. It provides the most comprehensive information about worldwide manufacturers, including Chinese and Eastern European companies, with production type, status and capacity.

The data presented are the most up-to-date from Yole Développement’s power electronics team, collected through its large contact base, as well as through its extensive access to publications and exhibitions.

In an Excel format including stats and graphs, Yole Développement’s database allows a completely customized analysis of the market and technology – suited to your business needs. This is a unique tool for business and marketing managers, institutions and investors, as well as system manufacturers in the power electronics community.

Use the included graphs or make you own analysis of the power semiconductor fab landscape; more than 350 players in power electronics are identified worldwide, with statistics, graphs and pivot tables for your custom analysis!

Key features
For the more than 350 companies included in the power fab database, the following information is provided:
o Company and mother company
o Fab details (name - address – country – area – phone/fax – website – region - area) and fab type (front-end, back-end, foundry, fabless)
o Clean room details (size, class, construction and equipment cost and year)
o Process technology (Bipolar, BICMOS, BCD, CMOS) - Maximum voltage
o Substrate material (Si, SiC, Sapphire, GaAs, GaN, SOI)
o Company contact (name – position – e-mail – phone)
o Type of devices (MOSFET, IGBT, thyristor/SCR/GTO, BJT, diodes, power IC, IPM, power modules, other FET)
o Wafer characteristics (FZ/CZ, geometry, size, active layer)
o Production capacity in wafers per month

And included analysis and graphs on:
o World fab rankings
o Production split by player, area, country, device type and wafer size

More information on the report here.



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