Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronixs direct bonding technologies, ZiBond and Direct Bond Interconnect (DBIŽ).
“There is a direct and robust synergy between our own 3D technology (FaStack®) and the Ziptronix technologies,” said Bob Patti, CTO of Tezzaron.
“DBI, ZiBond, and FaStack make a formidable team. This agreement greatly enhances our ability to produce advanced 3D memories. It also extends our open platform and broadens the scope of 3D and 2.5D devices that we can assemble for customers. With this suite of powerful technologies, we offer a truly ‘one stop’ solution for both 3D and 2.5D.”
Dan Donabedian, CEO of Ziptronix, said: “We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for 3D memory. With our DBI®, which contains interconnect at the bond interface, Tezzaron can provide a technologically superior product in the memory market at a lower cost and better performance compared to competitors also attempting 3D integration of advanced memory devices. Tezzaron stands alone today in its adoption of the most advanced interconnection technology and therefore will lead the industry in technology areas only imagined just a few short years ago.”
For more information about Ziptronix’s 3D IC technology and its licensing agreement with Tezzaron, contact Chris Sanders at firstname.lastname@example.org, call 919-459-2444 or visit www.ziptronix.com. For more about Tezzaron’s 3D and 2.5D technologies, contact Gretchen Patti at email@example.com, call 630-505-0404, or visit www.tezzaron.com.
Based in Research Triangle Park, NC, Ziptronix, Inc. is a pioneer in the development of low temperature direct bonding technology for advanced semiconductor applications. Ziptronix is a leader in IP for innovative 3D integration technology for advanced CMOS ICs, with established patent protection for its ZiBond® low temperature bonding (e.g. US Patent 6,902,987, 7,041,178, 7,335,572, 7,387,944) and DBI® direct bond interconnect (e.g. US Patent 6,962,835, 7,602,070) technologies.
Founded in October 2000, Ziptronix was spun out from North Carolina’s RTI International for the purpose of commercializing their revolutionary wafer and die bonding (ZiBond®) and bonding with interconnect (DBI®) technologies.
The company has an extensive worldwide patent portfolio covering the fundamental concepts behind economical low temperature direct bonding and direct bonding with interconnect. Ziptronix technology provides the lowest cost solution for low temperature wafer-to-wafer and die-to-wafer bonding, delivering significant advantages in size reduction, lower production costs, lower power consumption and increased system performance.
Based in Naperville, Illinois, Tezzaron Semiconductor Corporation is the leader in design and production of true three-dimensional integrated circuits (3D-ICs). Tezzaron 3D-ICs are vertically interconnected with built-in through-silicon vias (TSVs) so that the separate layers function together as a single circuit, vastly increasing density and speed while using less power. Tezzaron also builds patented ultra-high-speed memory products. Tezzaron’s products and technologies have applications in defense, super-computing, consumer electronics, high speed telecommunications, data centers, scientific data acquisition, and anywhere that speed, reliability, and power optimization are needed.