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May 2nd, 2014
Ziptronix licenses ZiBond to IO Semiconductor for RF applications
Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products.
The agreement also marks a new high-volume application market for Ziptronix’s proprietary ZiBond technology.
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