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May 2nd, 2014
 
Ziptronix licenses ZiBond to IO Semiconductor for RF applications
 
Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products.
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The agreement also marks a new high-volume application market for Ziptronix’s proprietary ZiBond technology.

IOsemi’s ZEROcap CMOS technology is based on a mature 0.18µm CMOS process. It provides RF performance with lower insertion loss and better linearity than other available technologies. This performance is achieved while delivering smaller footprints and lower cost than competitive devices. Implementing ZiBond further enables the low-cost manufacture of RF switches using standard CMOS processes. Because the bond itself is as strong as or stronger than the bulk material, it stands up better to post-bond processes than other bonding technologies.

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