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Advanced Packaging

The new three times larger laboratory equipped with cutting-edge equipment will open in Shin-Kawasaki. Hitachi Chemical announces the relocation of its Open Laboratory (Tsukuba, Ibaraki Prefecture) to Kawasaki City (Shin-Kawasaki), Kanagawa Prefecture, in order to strengthen the laboratory’s functions.

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Plasma-Therm has been selected by the ASE Group (Advanced Semiconductor Engineering) to provide plasma dicing capability at their Chung-Li, Taiwan facility. The Plasma Dicing on Tape (PDOT) production system will be available for customer demonstrations, development and prototyping in early 2017.

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Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC  package substrate came from DC/DC  converters in smartphones, penetration in other market segments of interest to embedded die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles.

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3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back.

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At the recent IMAPS 3D ASIP conference Amkor Technology (Amkor)’s Mike Kelly, Sr. Director of Advanced packaging, updated their status on their advanced packaging options. thought it was worth… a closer look.

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Amkor Technology announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT™). SWIFT is designed to handle the demanding requirements of today's advanced mobile, networking and system-in-package (SiP) applications.

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Upcoming Events

> IC Packaging Technology Expo
(January 18 - January 20, Tokyo, Japan)

> European 3D Summit
(January 23 - January 25, Grenoble, France)

(February 8 - February 10, Seoul, Korea)

Latest Reports


Memory Packaging Overview: Technology & Market Trends
Discover the presentation held by Emilie Jolivet at 3D ASIP, in San Francisco, USA, in Decem...
Advanced Pakaging: Even Moore Than You Expect !
Discover the presentation held by thibault Buisson at SEMICON Europe 2016
Fan-Out Packaging: Market and Technologies Trends
Discover the presentation held by Jérôme Azemar on IMAPS Pasadena in USA, 12th of October.

Access to all our presentations