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Advanced Packaging

Rudolph Technologies, announced that a memory manufacturer in Asia has placed orders totaling over $8 million USD for process control equipment to support the ramp of their latest high-performance stacked memory devices. The equipment spans front- and back-end applications. It includes MetaPULSE metrology systems for plating and etch control and NSX® 330 systems for two- and three-dimensional (2D/3D) inspection and metrology throughout the back-end process. The systems are scheduled to ship in the first quarter of this year.

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GE Ventures and Samsung Electro-Mechanics (SEMCO), a world actor in electronic components, announced a multi-year, worldwide patent license agreement. With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

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2016 was a year of strong consolidation in the semiconductor industry, with many acquisitions in a wide variety of fields along with enormous transactions worth several billions of dollars. 2017 seems to be following the same path, with recent announcements in the advanced packaging industry that are motivated by the recent focus on innovative platforms like fan-out packaging.

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Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications. Ultratech, a supplier of lithography, laser¬ processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

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MediaTek announced the launch of its MediaTek Helio P25, the newest addition to the MediaTek Helio P series mobile processor family. The new chipset combines the power of 16nm Octa-core processing with MediaTek Imagiq - a superior Image Signal Processor (ISP) technology - and dual camera features to satisfy smartphone photographers.

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USound and Fraunhofer Institute develop micro-speaker with innovative MEMS technology. Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the first based on micro-electro-mechanical systems (MEMS).

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Upcoming Events

> ISS Europe 2017
(March 5 - March 7, Munich, Germany)

> 13th International Conference and Exhibition on Device Packaging
(March 6 - March 9, Fountain Hills, Arizona)

(March 14 - March 16, Shanghai, China)

Latest Reports


3D Packaging: A Key Enabler for Further Integration and Performance
Discover the presentation held by Thibault Buisson at European 3D Summit, in Grenoble, Franc...
Memory Packaging Overview: Technology & Market Trends
Discover the presentation held by Emilie Jolivet at 3D ASIP, in San Francisco, USA, in Decem...
Advanced Pakaging: Even Moore Than You Expect !
Discover the presentation held by thibault Buisson at SEMICON Europe 2016

Access to all our presentations