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Advanced Packaging

At the recent IMAPS 3D ASIP conference Amkor Technology (Amkor)’s Mike Kelly, Sr. Director of Advanced packaging, updated their status on their advanced packaging options. i-Micronews.com thought it was worth… a closer look.

A summary of the type and commercial status of Amkor advanced packaging options is shown below where the SWIFT and SLIM multi-die options are compared to the more standard WLP, fan-out and FCBGA. Note that at this point both SWIFT and SLIM are in prototype / development status.


Type and commercial status of Amkor advanced packaging optionsType and commercial status of amkor advanced packaging options [source: Amkor, M. Kelly 3D ASIP 2016]

Amkor’s 2.5D interposer solutions are currently focused on data center, networking, HPC and military applications. Kelly described Amkor’s 2.5D production readiness as follows:

MEOL wafer thinning and backside processing

  • 300mm TSV line in K4 with K5 starting Jan 2017
  • SPC control and automated wafer handling
  • yield > 97.5 % (die level)

Assembly

  • Production in K4 (85K parts built to date)
  • Yields > 98%

The process flow for SWIFT and SLIM are shown below. The main difference being whether the interconnect layers are fabricated in the Fab BEOL or by Amkor using their in house RDL technology.


Process flow for Amkor SWIFT and SLIM Process flow for Amkor SWIFT and SLIM [source: Amkor, M. Kelly 3D ASIP 2016]

The higher density foundry interconnect layers of SLIM result in higher possible routing density, i.e. SLIM > 3X SWIFT > 3X FC.


SLIM and SWIFT signal routing comparisonSLIM and SWIFT signal routing comparison [source: Amkor, M. Kelly 3D ASIP 2016]

Kelly offered an electrical / mechanical comparison of 2.5D to SLIM and SWIFT as shown below. SLIM results in improved electrical performance since the bulk silicon is removed and smaller L/S since the interconenct layers are formed in the Fab.

Signal electrical mechanical comparison AmkorI/O signal electrical and mechanical comparison [source: Amkor, M. Kelly 3D ASIP 2016]

In a comparison of SWIFT and SLIM to 2.5D and 2.1D, Amkor indicates that cost is in the order 2.1D > 2.5D > SLIM > SWIFT > FCBGA. Surprising on this ordering is where they place the 2.1D solutions. 


Comparison advanced high end packaging platforms AmkorComparison of advanced high end packaging platforms [source: Amkor, M. Kelly 3D ASIP 2016]

Kelly described Amkor’s SLIM & SWIFT commercial readiness as:
SWIFT
- internally qualified and read for prototype sampling
- ready for small body high volume production in Q2 2017 in K5
- large body process in development
SLIM
- internally qualified for 15mm body size
- working with foundry partner
- ready for prototyping
- large body process in development

Kelly also offered the possibility of combining SLIM and SWIFT layers to customize solutions for both performance and cost.

From Phil Garrou for Yole Développement

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