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Jul 31st, 2012
The changing role of the OSAT
As process geometries and packaging technologies have matured over time, the OSAT (outsourced semiconductor assembly and test) provider has played an evolving role in the semiconductor packaging ecosystem. With true 3D chip stacking on the horizon, their role may evolve once again as ecosystem players jostle for position in the 3D universe.
There are two things that are likely to change with 3D, according to Raj Pendse, vice president and chief marketing officer at StatsChipPac. “The first one is that the very thought that a foundry would look at 2.5D as an extension of their SoC integration/monolithic silicon approach would mean that they would try to control certain parts of this flow.”
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