The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving increased functional convergence as well as increased packaging complexity and sophistication. This article will highlight the rapidly moving trend towards both super-thin and high-bandwidth packaging technologies, which are propelling an unprecedented demand to increase the variety of wafer level packaging, thin package-on-package (PoP), and through silicon via (TSV) / interposer packaging solutions. If flip chip is the current workhorse, then we can expect to see more exciting interconnect technologies such as TSV, 2.5D interposers, and fan-out (FO) wafer-level packaging (WLP) to meet these needs.

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