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Oct 30th, 2012
The equipment & materials business will grow by 4X in the next five years, estimates Yole Développement
« Equipment & Materials for 3DIC & Wafer-Level-Packaging», a report from Yole Développement.
Yole Développement announces its Equipment & Materials for 3DIC & Wafer-Level-Packaging report. In this report, Yole Développement provides the 2011-2017 wafer forecast for wafer-level-packages as well as WLP equipment & materials market forecasts. Together with detailed WLP & other process flows/scenarios analysis, an Excel Database screening and profiling the activities of 375+ small, medium and large equipment & materials suppliers is delivered.
Equipment & materials suppliers of front-end and back-end areas are finding business opportunities in the « middle-end »
“The material market will grow from ~$590M this year to over $2B by 2017 with a CAGR of 24%, driven mainly by the expansion of 2,5D interposers and 3D TSV & WLP platforms,” explains Amandine Pizzagalli, Technology & Market Analyst, Advanced Packaging, at Yole Développement.
Also, the equipment market reached a value of ~$870M in 2011 with a CAGR of 28% fueled by the 3D IC technology with TSV interconnects, which represents one of the main emerging areas in the coming years; an area offering opportunities for new equipment modification and new materials development.
A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV & WLP markets last year and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.
Market share for 3DIC/WLP: breakdown by equipment & materials
We can identify three main groups of equipment suppliers coming from different business markets:
The competitive landscape and market share for all main equipment & materials suppliers is quantified and detailed in this report.
Complete technologies update for each type of equipment & material used in 3D TSV & WLP applications
Technologies related to equipment & materials used for different process flows are included in this report.
All key scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle & Via Last processes.
Analysis on the “Via first” process flow is detailed in this report as well.
Database with 375+ key equipment & materials suppliers for 3DIC/WLP
Along with the new research presented in this updated report, Yole Développement delivers an Excel database which screens and profiles the detailed activity of more than 375+ small, medium and large equipment & materials suppliers coming from either the Front-end, Back-end assembly, PCB, LCD or Solar industries, and providing actual solutions for the 3DIC and wafer-level-packaging toolbox.
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