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Jul 17th, 2012
A giant leap? An evolutionary path? How all roads lead to 3D
Here is an interesting article discussing 3D packaging adoption, especially for NAND flash memory.
With Intel already ramping its 22nm manufacturing process into high volume using its third-generation high-k metal gate and Tri-gate (fully-depleted) transistors, the company is advancing its Atom processor roadmap at twice the rate of Moore’s Law through 2014. In a pre-SEMICON West interview, Kaizad Mistry, Intel’s VP of logic technology integration, told SEMI that the company will be extending its Tri-gate to 14nm, with a second generation fin-based architecture.
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