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Jul 17th, 2012
 
A giant leap? An evolutionary path? How all roads lead to 3D
 
Here is an interesting article discussing 3D packaging adoption, especially for NAND flash memory.
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With Intel already ramping its 22nm manufacturing process into high volume using its third-generation high-k metal gate and Tri-gate (fully-depleted) transistors, the company is advancing its Atom processor roadmap at twice the rate of Moore’s Law through 2014. In a pre-SEMICON West interview, Kaizad Mistry, Intel’s VP of logic technology integration, told SEMI that the company will be extending its Tri-gate to 14nm, with a second generation fin-based architecture.

Full text here.


 
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