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Jan 19th, 2012
First major 3D TSV wide-IO product announcement is made by Renesas
Today at ICP, the IC Packaging conference in Tokyo, Renesas Electronics Corp announced that it will be commercializing so-called “wide-IO interface” application processors with through silicon vias for mobile phones as soon as 2013.
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This major announcement is the first one concerning a product release using this long awaited technology, the aim of which is to considerably increase the data bandwidth between the phone processor and its associated DRAM memory. It is also, as we expect, the first one of a long series, as it may trigger similar moves by competitors.
Renesas precised that manufacturing of the SoC devices with through silicon vias will be outsourced to a partnering silicon foundry, which we think is one more clear sign that an infrastructure is building to produce the emerging 3D packaging technologies in volumes.



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