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Manufacturing

Rudolph Technologies, announced that a memory manufacturer in Asia has placed orders totaling over $8 million USD for process control equipment to support the ramp of their latest high-performance stacked memory devices. The equipment spans front- and back-end applications. It includes MetaPULSE metrology systems for plating and etch control and NSX® 330 systems for two- and three-dimensional (2D/3D) inspection and metrology throughout the back-end process. The systems are scheduled to ship in the first quarter of this year

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Toshiba announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

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Intel announced plans to invest more than $7 billion to complete Fab 42, which is expected to be the most advanced semiconductor factory in the world. The high-volume factory is in Chandler, Ariz., and is targeted to use the 7 nanometer (nm) manufacturing process. It will produce microprocessors to power data centers and hundreds of millions of smart and connected devices worldwide. The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

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Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications. Ultratech, a supplier of lithography, laser¬ processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

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MediaTek announced the launch of its MediaTek Helio P25, the newest addition to the MediaTek Helio P series mobile processor family. The new chipset combines the power of 16nm Octa-core processing with MediaTek Imagiq - a superior Image Signal Processor (ISP) technology - and dual camera features to satisfy smartphone photographers.

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Qualcomm and TDK announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE business unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.

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