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  July 31st - 10:22 am
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Home  > ADVANCED PACKAGING: 3D IC, WLP & TSV
  > Advanced Packaging: 3D IC, WLP & TSV
 
  >  TOP STORY
DALSA announces high performance BSI image sensor
DALSA today announced expanded capabilities including backside illumination (BSI) in custom image sensors for aerospace applications in earth observation and remote sensing. Key scientists and researchers around the world have used DALSA multispectral, hyperspectral and high resolution ...
 
 
  >  ANALYSIS
3D integration spurs momentum in Embedded die and Fan-Out wafer-level package technologies
Both technologies are on the verge of moving to high-volume production, so how do they “stack up,” and can we expect to see them in direct competition in the future?
Fan-out wafer-level package (FOWLP) technology has attracted plenty of ...
 
 
  >  INTERVIEW
NANIUM one of the first company to ramp-up 300mm eWLB into high volume production
We recently had the chance to visit NANIUM (previously Qimonda Portugal) nearby Porto in Europe. It is a pretty nice place for holidays for sure… but it also has a unique situation for packaging, assembly and test in Europe. With an impressive cumulated fab investment of about 1B$, NANIUM, founded in 2010 as a newly independent company, is shifting its business model and is moving from pure ...
 
 
  >  REVERSE ENGINEERING
Bosch's BMA220 three-axis accelerometer is a leap forward in innovation
Bosch is batting for top spot as a technical and market leader in inertial sensors with their launch of the BMA220 2mmx2mm, three-axis accelerometer. According to recent data from Yole Développement, Bosch has moved into 3rd sport in the MEMS market. In the past Bosch's primary focus has been the automotive market, but they have been aggressively pursuing the consumer electronics market...
 
 
  >  PRESENTATION
Semicon 2010 Yole HB LED & LED Packaging
Please download Jeff Perkins’ presentation made during Semicon West 2010 ...
 
 
  >  LATEST REPORT
Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate
...
 
 
  >  EVENTS
SEMICON Europa 2010: Advance Packaging Conference
The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as ...
 
 
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  >  NEWS
July 28th 2010
 


July 26th 2010
Two camps are pushing hard to introduce TSVs—the design community and the ...

July 21st 2010
Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process ...

July 20th 2010
Xilinx declined to comment, but a half-dozen independent industry sources familiar with...

July 19th 2010
Micronews had the pleasure to sit down with key ...

July 15th 2010
Electro Scientific Industries (Nasdaq: ESIO), a leading supplier of innovative, ...

July 15th 2010
At SEMICON West 2010, AMEC highlighed its rising market ...

July 15th 2010
This conference combines the previous ...

July 15th 2010
Under the exclusive agreement Dr. Garrou will contribute ...

July 13th 2010
In order to meet the technical challenges of 3D integration, each of these systems ...

July 13th 2010
3D IC offers more flexibility in the designs.  By minimizing interconnect length, ...

July 13th 2010
Funding has been facilitated by the Panasonic Venture Group, a Silicon Valley-based ...

July 13th 2010
Applied Materials, Inc. is leading the next technology inflection to advance ...

July 13th 2010
Final equipment installations will continue through to the end of this year with an ...

July 13th 2010
The company noted that the system shipped under an evaluation agreement and that it ...


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