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Power Electronics

GE Ventures and SHINKO ELECTRIC INDUSTRIES (SHINKO) announced that SHINKO has been granted a patent license and technology transfer of an advanced embedded packaging solution for power electronics called Power Overlay (POL).This patent license and technology transfer deal, signed in early 2015, is a strategic collaboration between GE and SHINKO in both technology and business development.

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Mentor Graphics has launched a new power tester specifically for the automotive market that will also cut simulation errors from 20% to just 0.5% when used in conjunction with the company’s thermal software.

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Company enables large energy savings in next generation power electronics.

Ascatron develops power semiconductors based on Silicon Carbide (SiC) that radically reduce losses in electrical transformers.

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Toyota, an automotive company aiming for safer, more efficient and convenient mobility, and Uber, a technology platform that is evolving the way the world moves, are announcing a partnership.

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GlobalWafers and Topsil Semiconductor Materials A/S have signed an agreement pursuant to which GlobalWafers will acquire Topsil’s entire silicon business at a price of DKK 320 million on a debt-free basis before transaction costs.

Topsil has been working with GlobalWafers for many years. In 2000, Topsil outsourced its Danish wafer production to GlobalWafers, which has since been a wafer processing supplier to Topsil.

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Nissan Motor, and Mitsubishi Motors announced that they have signed a Basic Agreement to form a far-reaching strategic alliance between the two Japanese automakers.
Following an MMC share issue, Nissan will take a 34 percent equity stake in MMC for 237 billion yen.
The strategic alliance will extend an existing partnership between Nissan and MMC, under which the two companies have jointly collaborated for the past five years.

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