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Fan-in WLP manufacturing capacities are full and more volume is required… Yole announces its new advanced packaging analysis (2)

“The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation”, asserts Andrej Ivankovic, Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement (Yole).


Hitachi received order of 2 energy storage for traction power supply system (B-CHOP system)

Hitachi, Ltd. announced that Hitachi received an order of 2 Energy Storage device for Traction Power Supply System (“B-CHOP system”) through Hitachi East Asia Ltd. from MTR Corporation Limited (“HONG KONG RAILWAY”), a railway company in Hong Kong for railway systems.


Soitec divests its solar system business to refocus on its core semiconductor activities

Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced a definitive agreement with ConcenSolar, a privately held company and a business partner of concentrator photovoltaic (CPV) leader Suncore Photovoltaic Technology Co Ltd, to divest its solar system business.


CREE to spin off Power and RF subsidiary in an IPO

Cree today announced that Cree’s wholly owned Power and RF subsidiary has submitted a draft registration statement on a confidential basis to the U.S. Securities and Exchange Commission for a potential initial public offering of the subsidiary’s Class A common stock.


Cree introduces new 900V SiC MOSFET family at PCIM

At PCIM (Power Conversion Intelligent Motion) Europe 2015 in Nuremberg, Germany (19-21 May), silicon carbide (SiC)-based power product maker Cree Inc of Durham, NC, USA — exhibiting with distributor partner MEV Elektronik Service GmbH — showcased its portfolio of SiC diodes, MOSFETs, modules, and bare die (including introducing a new family of 900V SiC MOSFETs) and demonstrated how its SiC technology can enable smaller, lower-cost and more efficient power systems capable of switching at higher frequencies and operating at higher temperatures.


X-FAB and Exagan partner to develop robust production process for high-volume GaN-on-Silicon devices on 200mm wafers

Leading Silicon Foundry and New GaN Start-Up Collaborate to Increase Manufacturability and Reduce Costs for Highly Efficient Power Switches.



> International Conference on Electricity Distribution - CIRED
(June 15 - June 18, Lyon, France)

> PCIM Asia
(June 24 - June 26, Shangai, China)

> Advancements in Thermal Management
(August 5 - August 6, Denver, USA)

Successful Semiconductor Fabless 2015
(November 4 - November 6, Paris, France)