Fan-in WLP manufacturing capacities are full and more volume is required… Yole announces its new advanced packaging analysis (3)
- May 28, 2015
- May 22, 2015
MultiX, the leading company in spectroscopic X-ray imaging for airport security and non-destructive testing applications announces to have acquired 3 million euros on the occasion of its third raise of capital combining financing from ACE Management, Amorçage Technologique Investissement, CEA Investissement, EurekaP, Expansinvest, Rhône-Alpes-Création and Thales Corporate Ventures and Thales Corporate Ventures, as well as from banking partners BPI and BNP.
- May 27, 2015
Drones can be used for recreational purposes virtually everywhere without needing to complete any administrative processes (excluding populated and built-up areas, sensitive, industrial, military or airport locations), provided that they remain in the pilot’s direct line of sight.
Sony releases IMX250 & IMX252 – CMOS image sensors with a 3.45 µm pixel and global shutter function for industrial applications
- May 21, 2015
Industrial applications demand imaging of fast-moving subjects. However, there is the issue that existing CMOS image sensors are unable to accurately identify fast-moving subjects due to focal plane distortion as a result of rolling shutter operation.
- May 27, 2015
- May 18, 2015
CSEM’s Vision-In-Package system is the first of its kind to combine all elements of a vision system into less than 1 cubic centimeter.
- Amantys Ltd – Applying digital techniques to the intelligent control of power
- Richardson RFPD introduces three new 650V NPT IGBTs with integrated SiC anti-parallel diodes from microsemi
- Power packaging is becoming a strong added value activity…
- Power devices: Growth is back again...
- Cree power modules revolutionize inverter platform for power-generation systems
> International Conference on Electricity Distribution - CIRED
(June 15 - June 18, Lyon, France)
> PCIM Asia
(June 24 - June 26, Shangai, China)
> Advancements in Thermal Management
(August 5 - August 6, Denver, USA)
> Successful Semiconductor Fabless 2015
(November 4 - November 6, Paris, France)