<?xml version='1.0' encoding='iso-8859-1'?><rss version='2.0'><channel><language>en</language><copyright>Copyright 2007, Yole Developpement</copyright><title><![CDATA[I-micronews - Power]]></title><link>http://www.i-micronews.com/thematique.asp?them=12</link><description><![CDATA[POWER ELECTRONICS]]></description><lastBuildDate>Friday, 24 May 2013 01:47:40</lastBuildDate><item><title><![CDATA[Infineon showcases 650V TRENCHSTOP™ 5]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10488</link><pubDate>Friday, 24 May 2013 01:47:40</pubDate><description><![CDATA[Infineon Technologies highlighted its 650V TRENCHSTOP™ 5 at the PCIM Europe 2013 in Nuremberg. ]]></description></item><item><title><![CDATA[Alstom Grid and KEPCO create strategic power electronics joint venture]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10489</link><pubDate>Friday, 24 May 2013 01:47:40</pubDate><description><![CDATA[Alstom Grid and Korea Electric Power Corporation (KEPCO), one of the largest electric utilities in the world, have announced the creation of KEPCO Alstom Power Electronics Systems (KAPES). ]]></description></item><item><title><![CDATA[Infineon enables faster and more cost-effective realization of ASIL C/D designs for hybrid and electric vehicle subsystems; announces early samples of EiceDRIVER™ SIL and EiceDRIVER™ boost IGBT drivers]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10490</link><pubDate>Friday, 24 May 2013 01:47:40</pubDate><description><![CDATA[Infineon Technologies introduced its next generation of high-voltage IGBT gate drivers. 
]]></description></item><item><title><![CDATA[IGBT market: Entering a new era - Presentations available]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10484</link><pubDate>Thursday, 23 May 2013 14:18:33</pubDate><description><![CDATA[The presentations of the market briefing, held at PCIM Europe 2013 on May 15, are now available.]]></description></item><item><title><![CDATA[Mitsubishi Electric launches SiC Power Semiconductor modules]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10465</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[Mitsubishi Electric Corporation (TOKYO: 6503) announced the launch of three types of silicon carbide (SiC) power modules for home appliances, industrial equipment and railcar traction systems. ]]></description></item><item><title><![CDATA[Obama administration’s financial opportunity for innovation Institute on wide bandgap semiconductors]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10466</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[The Obama Administration announced on the 9th of May $200 million in funding for three new institutes to accelerate innovation in U.S. manufacturing. ]]></description></item><item><title><![CDATA[Toshiba launches SiC hybrid power module for high power switching, Inverter and motor control applications]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10467</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[Toshiba Electronics Europe (TEE) has announced a hybrid N-channel IEGT (Injection-Enhanced Gate Transistor) module that features an embedded silicon carbide (SiC) fast recovery diode (FRD).]]></description></item><item><title><![CDATA[AEG Power Solutions introduces modular PV inverter for U.S. commercial applications]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10468</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[AEG Power Solutions introduces a new modular photovoltaic (MPV) solar inverter, with leading-edge power electronics in a transformerless, modular design. ]]></description></item><item><title><![CDATA[Cree’s new power module enables higher-performance, more-reliable and lower-cost power conversion systems compared to state-of-the art silicon modules]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10469</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[Cree is introducing the industry’s first commercially available silicon-carbide (SiC) six-pack power module in an industry-standard 45-mm package. ]]></description></item><item><title><![CDATA[ON Semiconductor introduces best in class system level performance expansion to IGBT portfolio
]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=10470</link><pubDate>Saturday, 18 May 2013 02:29:37</pubDate><description><![CDATA[ON Semiconductor continues to expand its portfolio of high performance IGBTs targeted at high performance power conversion (HPPC) consumer appliance and industrial applications. ]]></description></item><item><title><![CDATA[Raytheon rides the wave of SiC’s efficiency]]></title><link>http://www.i-micronews.com/upload/Interviews/PowerDev_April2013_Raytheon.pdf</link><pubDate>Tuesday, 7 May 2013 16:08:41</pubDate><description><![CDATA[The company’s recently-opened £3.5 million 4-inch SiC foundry in Glenrothes, UK, will produce devices for both new entrants and established players, explain Paul D’Arcy, Business Unit Manager for Semiconductors, and Ewan Ramsay, Principal
Engineer....]]></description></item><item><title><![CDATA[Reliability and quality drive IGBT modules]]></title><link>http://www.i-micronews.com/upload/Interviews/Power Dev_January2013_PowerIntegrations.pdf</link><pubDate>Wednesday, 20 Feb 2013 10:46:43</pubDate><description><![CDATA[Drivers and bias supplies supplied by Power Integrations and its subsidiaries promise long lifetimes, says Doug Bailey, the company’s vice president, marketing, while its Qspeed diode business expands, thanks to products that deliver SiC-like ...]]></description></item><item><title><![CDATA[Parylene films show their dielectric strength]]></title><link>http://www.i-micronews.com/upload/Interviews/PowerDev_Oct2012_Specialty Coating Systems.pdf</link><pubDate>Wednesday, 7 Nov 2012 17:50:22</pubDate><description><![CDATA[Parylene’s insulating and water barrier properties means Specialty Coating Systems can help meet the needs of modern power electronics modules, says Alan Hardy, the company’s automotive, electronics and military market manager. What relevance does a ...]]></description></item><item><title><![CDATA[EBG Resistors: Innovation delivers pinpoint resistor
performance]]></title><link>http://www.i-micronews.com/upload/Interviews/PowerDev_July2012_EBG Resistors.pdf</link><pubDate>Thursday, 19 Jul 2012 14:22:32</pubDate><description><![CDATA[The processes EBG Resistors uses to make its metal oxide devices ensure it can meet demanding specifi cations with short lead times, explains general manager Alois Klein....]]></description></item><item><title><![CDATA[Mersen: Interdependent passive components extend turbine limits]]></title><link>http://www.i-micronews.com/upload/Interviews/Power Dev_April2012_Mersen.pdf</link><pubDate>Friday, 27 Apr 2012 14:58:27</pubDate><description><![CDATA[Jean-François de Palma, power electronics specification engineering manager at Mersen explains how the company’s busbars, cooling systems and fuses will enable higher power wind turbines....]]></description></item></channel></rss>
