<?xml version='1.0' encoding='iso-8859-1'?><rss version='2.0'><channel><language>en</language><title>I-micronews - Reports</title><link>http://www.i-micronews.com/outilRapport.asp</link><description><![CDATA[MEMS,COMPOUND SEMI,MICROFLUIDICS,PHOTOVOLTAIC,IC MANUFACTURING,ADVANCED PACKAGING:3DIC,WLP & TSV,NANOMATERIALS]]></description><copyright>Copyright 2007, Yole Developpement</copyright><lastBuildDate>Monday, 21 May 2012 17:45:26</lastBuildDate><item><title><![CDATA[Thin Film Photovoltaics CIS/CIGS Technology & Market]]></title><link>http://www.i-micronews.com/afficher.asp?id=290&amp;titre=Thin+Film+Photovoltaics+CIS%2FCIGS+Technology+%26+Market&amp;searchfield=</link><pubDate>Friday, 8 Jun 2012 00:00:00</pubDate><description><![CDATA[PV industry Status & Trends
Position of thin film CIS/CIGS technology within the tough PV market.
]]></description></item><item><title><![CDATA[MEMS for Cell Phones & Tablets]]></title><link>http://www.i-micronews.com/afficher.asp?id=288&amp;titre=MEMS+for+Cell+Phones+%26+Tablets&amp;searchfield=</link><pubDate>Tuesday, 5 Jun 2012 00:00:00</pubDate><description><![CDATA[20% annual growth to reach $5.4B in 2017!]]></description></item><item><title><![CDATA[Deep Reactive Ion Etching

]]></title><link>http://www.i-micronews.com/afficher.asp?id=289&amp;titre=Deep+Reactive+Ion+Etching%0D%0A%0D%0A&amp;searchfield=</link><pubDate>Saturday, 2 Jun 2012 00:00:00</pubDate><description><![CDATA[The number of wafers processed with DRIE will see 5X growth 2011 – 2017]]></description></item><item><title><![CDATA[Polymeric Materials for 3DIC & WLP Applications]]></title><link>http://www.i-micronews.com/afficher.asp?id=284&amp;titre=Polymeric+Materials+for+3DIC+%26+WLP+Applications&amp;searchfield=</link><pubDate>Thursday, 31 May 2012 00:00:00</pubDate><description><![CDATA[The first complete report analyzing in detail the  opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications.]]></description></item><item><title><![CDATA[ III-V Epitaxy Equipment & Applications Market
]]></title><link>http://www.i-micronews.com/afficher.asp?id=274&amp;titre=+III%2DV+Epitaxy+Equipment+%26+Applications+Market%0D%0A&amp;searchfield=</link><pubDate>Tuesday, 22 May 2012 00:00:00</pubDate><description><![CDATA[Anticipating the next investment cycle after the dip.
]]></description></item><item><title><![CDATA[GaAs Wafer Market & Applications]]></title><link>http://www.i-micronews.com/afficher.asp?id=280&amp;titre=GaAs+Wafer+Market+%26+Applications&amp;searchfield=</link><pubDate>Tuesday, 22 May 2012 00:00:00</pubDate><description><![CDATA[RF electronics currently fuels the GaAs wafer market… But LEDs will rapidly lead the growth GaAs.]]></description></item><item><title><![CDATA[Nemotek Wafer-Level Camera Shellcase® ]]></title><link>http://www.i-micronews.com/afficher.asp?id=291&amp;titre=Nemotek+Wafer%2DLevel+Camera+Shellcase%AE+&amp;searchfield=</link><pubDate>Monday, 21 May 2012 00:00:00</pubDate><description><![CDATA[Teardown & Reverse costing of the newest wafer-level camera supplied by Nemotek Technologie for portable applications
]]></description></item><item><title><![CDATA[CREE - XLAMP® XB-D COOL WHITE LED]]></title><link>http://www.i-micronews.com/afficher.asp?id=283&amp;titre=CREE+%2D+XLAMP%AE+XB%2DD+COOL+WHITE+LED&amp;searchfield=</link><pubDate>Friday, 27 Apr 2012 00:00:00</pubDate><description><![CDATA[Teardown and Reverse Costing for the latest Xlamp® XB-D, the new cool white LED supplied by Cree, Inc.]]></description></item><item><title><![CDATA[Qualcomm Mirasol ® Display
]]></title><link>http://www.i-micronews.com/afficher.asp?id=285&amp;titre=Qualcomm+Mirasol+%AE+Display%0D%0A&amp;searchfield=</link><pubDate>Thursday, 26 Apr 2012 00:00:00</pubDate><description><![CDATA[Teardown & Reverse Costing on the new generation of MEMS Interferometric modulator.]]></description></item><item><title><![CDATA[STMicroelectronics MP45DT01 MEMS Microphone]]></title><link>http://www.i-micronews.com/afficher.asp?id=286&amp;titre=STMicroelectronics+MP45DT01+MEMS+Microphone&amp;searchfield=</link><pubDate>Friday, 6 Apr 2012 00:00:00</pubDate><description><![CDATA[Teardown & Reverse Costing Analysis of the latest ST Microelectronics, using a MEMS die manufactured by Omron.]]></description></item></channel></rss>

