<?xml version='1.0' encoding='iso-8859-1'?><rss version='2.0'><channel><language>en</language><title>I-micronews - Reports</title><link>http://www.i-micronews.com/outilRapport.asp</link><description><![CDATA[MEMS,COMPOUND SEMI,MICROFLUIDICS,PHOTOVOLTAIC,IC MANUFACTURING,ADVANCED PACKAGING:3DIC,WLP & TSV,NANOMATERIALS]]></description><copyright>Copyright 2007, Yole Developpement</copyright><lastBuildDate>Wednesday, 22 May 2013 18:48:06</lastBuildDate><item><title><![CDATA[IGBT Markets and Application Trends]]></title><link>http://www.i-micronews.com/afficher.asp?id=371&amp;titre=IGBT+Markets+and+Application+Trends&amp;searchfield=</link><pubDate>Monday, 3 Jun 2013 00:00:00</pubDate><description><![CDATA[IGBT application growth will lead the market to $6B+ by 2018]]></description></item><item><title><![CDATA[2.5D, 3DIC and TSV Interconnect Patent Investigation]]></title><link>http://www.i-micronews.com/afficher.asp?id=369&amp;titre=2%2E5D%2C+3DIC+and+TSV+Interconnect+Patent+Investigation&amp;searchfield=</link><pubDate>Friday, 31 May 2013 00:00:00</pubDate><description><![CDATA[3DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation.]]></description></item><item><title><![CDATA[SiC Market 2013]]></title><link>http://www.i-micronews.com/afficher.asp?id=368&amp;titre=SiC+Market+2013&amp;searchfield=</link><pubDate>Saturday, 25 May 2013 00:00:00</pubDate><description><![CDATA[Displacement of silicon has already begun...]]></description></item><item><title><![CDATA[Flexible Applications Based on Printed Electronics Technologies]]></title><link>http://www.i-micronews.com/afficher.asp?id=367&amp;titre=Flexible+Applications+Based+on+Printed+Electronics+Technologies&amp;searchfield=</link><pubDate>Friday, 24 May 2013 00:00:00</pubDate><description><![CDATA[Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!]]></description></item><item><title><![CDATA[MEMS Gyroscope Patent Investigation]]></title><link>http://www.i-micronews.com/afficher.asp?id=366&amp;titre=MEMS+Gyroscope+Patent+Investigation&amp;searchfield=</link><pubDate>Monday, 6 May 2013 00:00:00</pubDate><description><![CDATA[MEMS gyroscopes are currently a very hot business. Investigating the patent situation is essential to understanding the present business climate and anticipating future developments.]]></description></item><item><title><![CDATA[Glass Substrates for Semiconductor Manufacturing]]></title><link>http://www.i-micronews.com/afficher.asp?id=362&amp;titre=Glass+Substrates+for+Semiconductor+Manufacturing&amp;searchfield=</link><pubDate>Friday, 26 Apr 2013 00:00:00</pubDate><description><![CDATA[The glass wafer market will reach more than 15M 8” EQ WSPY by 2018, driven by 2.5D interposer and carrier wafer functionalities.]]></description></item><item><title><![CDATA[MEMS Pressure Sensor]]></title><link>http://www.i-micronews.com/afficher.asp?id=359&amp;titre=MEMS+Pressure+Sensor&amp;searchfield=</link><pubDate>Monday, 22 Apr 2013 00:00:00</pubDate><description><![CDATA[After years of limited growth, the MEMS pressure sensor market is growing due to consumer electronic applications and is expected to show a 22% CAGR]]></description></item><item><title><![CDATA[Biophotonics Market]]></title><link>http://www.i-micronews.com/afficher.asp?id=360&amp;titre=Biophotonics+Market&amp;searchfield=</link><pubDate>Friday, 19 Apr 2013 00:00:00</pubDate><description><![CDATA[Life sciences & health applications are driving biophotonics market growth. New technologies based on photon interaction with tissues will expand the biophotonics market from $23B in 2012 to $36B by 2017!]]></description></item><item><title><![CDATA[Nokia Lumia 920 - Camera Module with OIS]]></title><link>http://www.i-micronews.com/afficher.asp?id=370&amp;titre=Nokia+Lumia+920+%2D+Camera+Module+with+OIS&amp;searchfield=</link><pubDate>Monday, 15 Apr 2013 00:00:00</pubDate><description><![CDATA[The first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology
Hold a custom 8.7MP 1.4µm BSI CMOS Image Sensor]]></description></item><item><title><![CDATA[STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope]]></title><link>http://www.i-micronews.com/afficher.asp?id=363&amp;titre=STMicroelectronics+L3G4IS+Dual%2DCore+3%2DAxis+MEMS+Gyroscope&amp;searchfield=</link><pubDate>Wednesday, 10 Apr 2013 00:00:00</pubDate><description><![CDATA[The first dual-core MEMS gyroscope enabling both user interface (UI)and optical image stabilization (OIS) applications simultaneously.
Using a new THELMA Process - Extracted from the Nokia Lumia 920.]]></description></item></channel></rss>
