3DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation.
A very young patent landscape dominated by 10 companies...
For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened. 52% of the families have been classified as relevant and further studied. The indepth analysis quickly revealed that the overall patent landscape was pretty young with 82% of patents filed since 2006. Actually about 260 players are involved in 3DIC technology while the top 10 assignees represents 48% of patents filed in the 3DIC domain! We selected 5 companies from these 10 most active players to focus on and lead an accurate analysis of their patent portfolios.
The report also provides a database of all the relevant patents we have analyzed in an Excel file which allows multi-criteria searching. The criteria are basically those we used for the technological segmentation:
We found 4 main types of business models among the top 10 assignees involved in this mutating middleend area:
Foundries and IDM: IBM, Samsung, Intel
OSATs: STATS ChipPAC, Amkor
Memory IDM/Foundries: Micron, SK Hynix, Elpida
Research centers: ITRI
It is also interesting to notice that the USA is the early player increasingly involved in 3DIC since 1969. China and Korea are new players since 2005.
This complete description of the patent landscape is included in the first part of the report and provides all the background materials for the 3DIC patent landscape analysis. The report provides a complete analysis of the patent landscape including geographical origins of the patents, companies or R&D organizations that have been granted the patents, historical data on when the companies that have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations…
Understanding the patent portfolio of the top 10 3DIC asignees
The report provides a deep dive into each of the patent portfolios of assignees selected by Yole Développement, including Intel, Samsung, Micron, IBM and TSMC.
For each of these companies, the report provides an in-depth analysis of its patent portfolio, highlighting the following points:
Company patent portfolio evolution
Countries of deposition and origin of the patents
Technical segmentation of each patent portfolio
Patent portfolio analysis for each manufacturing process steps and architecture
Main technical innovations
This analysis of each company provides an in-depth view of the strengths and weaknesses of the patent portfolio of each company and the developments that are now implemented by these companies.
An overall patent ranking to identify the most promising patents!
A ranking of the most important patents is provided in this report to highlight the most promising. Other information includes: which of all the analyzed documents could be blocking, which company owns which patents and the contents of each patent. The ranking is based on a unique methodology which has been developed by KnowMade, Partner of Yole Développement, and is based on the evaluation of 14 parameters:
Innovation intensity of application field
Technology infringement capability
These parameters enable patent potential to be evaluated through 4 dimensions. The final patent potential is the average of scores for each parameter. A score between 1 and 10 is thus calculated for each dimension and for the global patent potential.
Methodology of the analysis
Based on requests on micropatent, and several other databases, Yole Développement has developed a unique methodology (described in the sample) to define a technical segmentation of the patent landscape, define which patents are the most innovative, either for future use or already in production. Yole Développement, by mixing its technical knowledge, business understanding and patent search, is able to provide unique analysis and added value in this report.
OBJECTIVES OF THE REPORT
Overview of « who is owning what » in terms of patents for the 3DIC & 2.5D Interposer technologies, plus a dedicated focus on 5 players we consider as the most active in this area
Presentation of the industrial and business status of the 3DIC today
Definition and delivery of a database of all the relevant patents with technological segmentation
Detailed architecture to be implemented
Identification of the key patents and their owners
Patent ranking and identification of the most promising patents to be used soon in future products
Analyze key patents to identify structuring concepts from a technological or an industrial point of view, leading to business and strategic conclusions
KEY FEATURES OF THE REPORT
Statistical analysis of existing IP to give a landscape overview and understand:
The evolution of patent families
Who are the main players involved in this field
In-depth analysis on 5 player portfolios selected by Yole Développement
Focus on IBM, Intel, Samsung, TSMC and Micron, including:
Patent evolution chart
Patent mapping for 3DIC technological process steps
Patent mapping for new architectures
In depth analysis of the main process steps
Patent ranking and detailed analysis of the key patents
Adopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level
Packaging (FO-WLP) is the most innovative, advanced packaging technology today.
Analysing patent status is the key to understanding the business situation.