The report provides more than 300 slides “ready to use” for your own business. IDMs and OSATs players have been investigated. For each profile, you will have access to the following features:
Company overview:
Financial highlights
Company products and markets
Strategic alliances & partnerships
Mapping of the R&D labs and main manufacturing fabs locations: Key R&D, Front-end, Back-end, and Assembly site activities have been identified
Key contacts developing the TSV technology
Summary of the 3D IC technologies developed
Latest announcements
Product Roadmaps
Product objectives A unique tool for equipment & material suppliers to develop their business worldwide with the key players of the 3D IC industrial value chain. A complete company profiles report to enable suppliers of semiconductor industry to detect new opportunities on the 3D Packaging semiconductor market.
Product overview This unique report & database will provide you a global picture of what is happening today in the 3D IC world: gain access quickly to the profiles of the Top 50 key players developing the TSV “Through Silicon Via” technology, including locations (R&D labs, cutting edge pilot lines and manufacturing plants), key business & technical contacts, product roadmaps, 3D processes developed, strategic alliances & partnerships. The covered geographical areas includes North America, Europe and Asia.
Key features Whiling to develop your business and learn more about the key 3D IC players? Our report and database are 2 unique tools to answer your questions:
Application fields covered:
RF-SiP: Integrated passives, antennas, amplifiers, MMICs, power components...
CMOS imagers: Chip scale Opto WLP and 3D LSI CMOS image sensors
Memories: NAND Flash, NOR Flash and DRAMs
3D MEMS: Silicon Microphones, pressure sensors, inertial sensors and MOEMS to be stacked on CMOS wafers
Memories & logic: FPGAs, SRAM / DRAM cache memories to be stacked directly onto microprocessor cores
Elements included: · Comprehensive Database:
3D IC segmentation incorporated
Customized research enabled
Easy to share & extract information
· Complete Profiles Report:
Top 50 players covered
3D technologies developed
Latest product achievements
Key Contacts & Locations
Companies Roadmaps to production
Facts & Figures For each player in the database, you will gets its:
Creation date, generic coordinates, clean room class & size, fab capacity, wafer size, product lines developed
3D technologies developed:
Stacking scheme: C2C, C2W, W2W, number of stacked layers
Bonding technology: Cu-to-Cu, adhesive, direct oxide, eutectic…
Wafer level: substrate material, wafer thickness budget, handling process developed
Via level: holes diameters, interconnect densities, drilling technologies (wet etch, laser, DRIE…) and filling processes (Copper, Tungsten, Poly-silicon…)
Who should buy this report?
Semiconductor players, equipment & material suppliers are targeted by this report:
Business development managers to access key contacts developing the 3D technologies and to define product development strategies
Marketing executives to find key figures and profiles for their strategic plans
Technical directors and development engineers to get a global overview of the market & technical requirements in order to evaluate and scale with their product development projects
Benefits
Our database references more than 400 fabs locations and about 250 qualified contacts involved in the developments of 3D ICs. For example, you can use this tool for:
Searching new qualified contacts to develop your business
Studying the profile and repartition of one given technology among the different industry players
Getting a wide-angle view on the 3D ICs market
Introduction
Why stacking chips in 3D?
Market drivers for 3D ICs
3D Packaging integration landscape
3D TSV interconnects Roadmap
Enabling Packaging technologies
3D ICs Market Forecasts
Worldwide 3D IC activity mapping
Geographical Breakdown
3D TSV Infrastructure & Supply chain
Applications/Markets Segmentation
Status of industrialization
3D TSV scenarios developed
Company Profiles
3D-Plus
Allvia
Amkor
ASE
ASET
DALSA Semiconductor
Elpida Memory
EPworks
Fraunhofer Institutes
Freescale Semiconductor
Hymite
Hynix Semiconductor
IBM
IMEC
Intel
Irvine Sensors
KTH
Leti
MagnaChip
Micron
Nanya
NEC Electronics
NXP Semiconductor
OKI Electric
Qimonda
Renesas
RPI
Samsung
Sanyo
Schott
Sharp
Silex Microsystems
Sony
Spansion
STATS ChipPAC
ST Microelectronic
Tessera
Tezzaron
Tohoku University
Toshiba
Tracit Technologies
TSMC
VTI
Xintec
Ziptronix
ZyCube
Annexes OptoPAC WL-CSP
Northrop Grumman
MIT TWV realizations
Sematech TWI Roadmap
3D IC Database informations
(*) The parts you have access. (*) Only available with an other downloadable parts.
To see what Yole Développement can do for your business, please click here or contact the specialist.
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Database & Company profiles Report
on the “Top 50” players developing 3D ICs