Yole Développement is proud to publish the reverse costing report on the AAC Acoustics available in the Apple Iphone4 smartphone.
This device is an analog MEMS Microphone using a free-floating diaphragm, and a capacitive sensing.
It offers a full integration of a MEMS microphone and an amplification ASIC, both provided by Infineon, in a 3-pin LGA package.
This microphone is for consumer applications: smartphones, cellphones.

The report provides complete teardown of the microphone MEMS with:

•  Detailed photos
•  Material analysis
•  Schematic assembly description
•  Manufacturing Process Flow
•  In-depth economical analysis
•  Manufacturing cost breakdown
•  Selling price estimation

TABLE OF CONTENTS

• Overview / Introduction p.4
  • Executive Summary
  • Reverse Costing Methodology
•  Company Profile p.6
  • AAC Acoustics       
•  Physical Analysis p.10
  • Package Characteristics & Markings
  • iPhone ‘ Microphone MEMS
  • Package X-Ray
  • Package Composition
  • Package Opening & Bonding Number
  • Package Cross-Section
  • ASIC Markings  and Dimensions
  • ASIC Minimal Dimension and Metal Layers
  • ASIC Process Characteristics
  • Microphone Markings & Dimensions
  • Microphone Details
  • Microphone Structure
  • Microphone Cross-Section
  • Microphone process characteristics
• Manufacturing Process Flow p.57
  • ASIC Process Flow
  • Microphone Process Flow
  • Package Process Flow
  • Wafer Fabrication Units   
• Cost Analysis p.69
  • Supply Chain Analysis
  • ASIC Wafer Cost
  • ASIC Die Cost
  • Microphone Wafer Cost Hypothesis
  • Microphone Wafer Cost
  • Microphone Die cost
  • SM0401 Packaging Process Flow
  • SM0401 Packaging Cost Details
  • SM0401 Final Test Cost
  • SM0401 Component Manufacturing Cost
  • Yield Synthesis
•  Estimated Manufacturer Price Analysis p.97
  • Manufacturers ratios   
  • Estimated manufacturer Price