Yole Développement is please to publish the reverse costing report of the 3-Axis Electronic Compass AK8973S supplied by Asahi Kasei Microsystems (AKM).

The AK8973S is a Si-monolithic 3-axis geomagnetic sensor based on Hall Effect technology. Using only one silicon die packaged at the wafer level, the WLP LGA package of the AK8973S achieves a dimension of 2.5x2.5x0.5mm. 

The AK8973S 3-Axis Compass is suitable for navigation systems in cell phones and personal navigation devices, and motion input in video game controllers.

This report provides complete teardown of the geomagnetic sensor with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

• Analyze the cost of projects at the R&D level
• Enhance the negotiation power of purchasing managers
• Benchmark competitor’s products

Glossary                                                              P 4

Overview/Introduction
 Executive Summary
 Reverse Costing Methodology

AKM Company Profile                                      P6

Physical analysis                                             P11

Synthesis of the Physical Analysis
Physical Analysis Methodology
Package Characteristics & Markings
Package X-Ray
Device Structure
 ASIC – Dimensions
 ASIC – Pads Distribution Reconstitution
 ASIC – Block Functions
 ASIC – Markings
 ASIC – Bond Pads
 ASIC – Capacitors/Resistors
 ASIC – Hall Sensors
 CMOS Hall Sensor Principle
 Component Cross-Sections
 Physical Data Summary
 Process Characteristics

Manufacturing Process Flow                        P 45

 Overview
 ASIC Process Flow
 Wafer-level Packaging Process Flow
 Description of the Wafer Fabrication Units

Cost Analysis                                                    P 52

 Synthesis of the Cost Analysis
 Main Steps of Economic Analysis
 Supply Chain Analysis
 Yields Hypotheses
 Front-End : Hypotheses
 Front-End Cost
 Back-End 0 : Probe Test Cost
 Back-End 0 : Packaging Hypotheses
 Back-End 0 : Packaging Cost
 Back-End 0 : Packaging Cost per Process Steps
 Back-End 0 : Dicing Cost
 Total Wafer Cost (Front-End + Back-End 0)
 Back-End 1 : Final Test & Calibration Cost
 AK8973S Cost (FE + BE 0 + BE 1)

Estimated Manufacturer Price Analysis        P 72

Conclusion                                                           P 76