TABLE OF CONTENTS
1. Overview / Introduction p.4
- Executive Summary
- Reverse Costing Methodology
2. Company Profile p.6
- Akustica Profile
- Akustica Business Model
3. Physical Analysis p.11
- Package Characteristics & Markings
- Package Pin-Out
- Package X-Ray
- Package Cross-Section
- Package Opening
- Die Dimensions
- Die Markings
- Membrane & Vent Holes
- Membrane Details
- Back Cavity & Vent Holes
- Delayering
- MEMS Structure
- MEMS Cross-section
- CMOS/MEMS Process Characteristics
4. Manufacturing Process Flow p.51
- CMOS Process Flow
- CMOS Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
5. Cost Analysis p.64
- CMOS Front-End : Hypotheses
- CMOS Front-End Cost
- MEMS Front-End : Hypotheses
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Material Cost per Family
- Back-End 0 : Probe Test & Dicing
- Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging Cost
- Back-End 1 : Final test & Calibration Cost
- AKU230 Component Cost (FE + BE0 + BE1)
6. Estimated Manufacturer Price Analysis p.85
- Manufacturers ratios
- Estimated manufacturer Price