Analog Devices ADXL278 Automotive – 2-Axis MEMS Accelerometer

Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

Yole Développement is proud to publish the reverse costing report of the dual-axis, high-g, MEMS Accelerometer ADXL278 supplied by Analog Devices for automotive applications. The ADXL278 is the fourth-generation surface micromachined iMEMS® accelerometer from ADI. It offers an integration of a MEMS accelerometer and a control IC in one silicon die. The component is provided in a standard ceramic LCC 8-pin package, compatible with SMD process. The ADXL278 2-axis MEMS accelerometer is designed for use in front and side impact airbag applications, but can be used in a wide variety of other applications.

This report provides complete teardown of the accelerometer with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

Overview/Introduction......................................................p4

• Executive Summary
• Reverse Costing Methodology

Product Specification.....................................................p6

Physical analysis.............................................................p10

• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings
• Package Opening
• Die Dimensions
• IC – Markings
• IC – Bond Pads & Wire Bondings
• IC – Logic Area
• IC – Analog Area
• IC – Metal Layer
• MEMS Sensor – Optical Overview
• MEMS Sensor – SEM Overview
• MEMS Sensor – SEM Views
• MEMS Cross-Section
• Physical Data Summary

Manufacturing Process Flow...................................p30

Cost Analysis.............................................................p33

• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Supply Chain Analysis
• Yields Explanation
• Economics Analysis
• Front-End Cost – Wafer Fab Unit
• Front-End Cost
• Back-End 0 : Probe Test
• Die per wafer & Probe Test
• Back-End 0 : Dicing
• Total Wafer Cost (Front-End + Back-End 0)
• Die cost
• Back-End 1 : Packaging Hypotheses & Process Flow
• Back-End 1 : Packaging Cost
• Back-End 1 : Final Test
• Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis...................................p50

 Conclusion...................................................................................p54