Glossary
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Bosch Sensortec Company Profile
• Bosch Sensortec
• BMA180 Specifications & Block Diagram
Physical analysis
• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings
• Package Opening & Bonding Number
• ASIC Markings
• ASIC Dimensions
• ASIC Minimal Dimension and Metal Layers
• ASIC Process Characteristics
• MEMS Markings
• MEMS Dimensions
• MEMS Details
• MEMS Cross-Sections
• MEMS process characteristics
• Thickness Comparisons with Previous Generation
Manufacturing Process Flow
• Overview
• ASIC Process Flow
• MEMS Process Flow
• Description of the Wafer Fabrication Units
Cost Analysis
• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Yields Explanation
• ASIC Wafer Cost Hypothesis
• ASIC Wafer Cost
• ASIC Probe & Dicing cost
• ASIC Die Cost
• MEMS Wafer Cost Hypothesis
• MEMS Wafer Cost
• MEMS Wafer Cost Breakdown per Steps
• MEMS Wafer : Equipment Cost per Family
• MEMS Wafer : Material Cost per Family
• MEMS Back end 0 : Probe & Dicing Cost
• MEMS Die cost
• Back-End 1 : Packaging, Final test, calibration
• BMA180 Component Cost (FE + BE 0 + BE 1)
• Yields Synthesis
Estimated Manufacturer Price Analysis
• Supply Chain Analysis
• Manufacturers ratios
• Estimated manufacturer Price
Conclusion