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MEMS : Bosch Sensortec BMC050 : 6-Axis Electronic Compass
 Teardown and Reverse costing of the latest BMC050, a 6-Axis electronic compass supplied by Bosch.
PRICE (Multi user license) : 3690 €
Publication date : 30 August 2012
Bosch Sensortec
BMC050 : 6-Axis Electronic Compass
Physical Analysis of the Devices
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement is pleased to publish the reverse costing report of the BMC050, a 6-Axis electronic compass supplied by Bosch.
Packaged in a LGA-16 pin housing, the device integrates two sensors into a very small space : a triaxial geomagnetic sensor for measuring the Earth’s magnetic field and a triaxial acceleration sensor for tilt compensation.
The triaxis magnetometer is manufactured in MEMS thin film technology and uses the new Bosch’s FlipCore measurement principle to calculate the direction.
The BMC050 is ideally suited for mobile phones, tablet PCs and notebooks. It features high sensitivity of 0.3 μtesla and low power consumption at 0.54 milliamps.
This report provides complete teardown of the E-compass with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
- Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Bosch Sensortec Company Profile
- Bosch Sensortec Profile
- Component Specifications
- Physical Analysis
- Synthesis of the Physical Analysis
- Package Characteristics & Markings
- Package Opening
- Package Cross Section
- Accelerometer ASIC - Process technology
- Accelerometer MEMS - Opening& Cross Section
- Accelerometer MEMS - Process technology
- Z-Axis Magnetometer - Marking& Cross Section
- Z-Axis Magnetometer - Process technology
- X/Y-Axis Magnetometer - Marking& Cross Section
- X/Y-Axis Magnetometer - Process technology
- Manufacturing Process Flow
- Wafers Fabrication Units
- Front-End Manufacturing Process Flow:
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit
- Cost Analysis
- Synthesis of the Cost Analysis
- Accelerometer ASIC Wafer Front-End Cost
- Accelerometer ASIC Die Cost
- Z-Axis Magnetometer Wafer Cost
- Z-Axis Magnetometer Die Cost
- MEMS Wafer Front-End Cost
- MEMS Front-End Cost per Steps
- MEMS Die Cost
- X/Y-Axis Magnetometer Wafer Cost
- X/Y-Axis Magnetometer cost per Steps
- X/Y-Axis Magnetometer Die Cost
- Back-End : Package Cost
- Back-End : Package Cost Per Steps
- BMC050 Manufacturing Cost
- Estimated Manufacturer Price
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