A comprehensive survey of usage and markets
through 2013 for: GaAs, GaP, InP, SiC, Sapphire and bulk-GaN

IN 2011, SAPPHIRE WILL EXCEED 50% OF THE CS PROCESSED SURFACE

Silicon largely dominates the semiconductor business as the reference material. However, specific applications such as optoelectronics, RF or power electronics require material properties that cannot be offered by silicon.

GaAs, GaN, GaP, GaAs, InP, SiC and Sapphire substrates now account for 1.1% of the 7,504 million square inches annually processed in semiconductor foundries. However, that small portion of processed area is compensated by a higher merchant price leading to a $880M raw substrate market size in 2009 and reaching the billion dollar threshold in 2010.

Up to now, GaAs was the leading material in volume thanks to the wireless technology and red / orange / yellow LED demand, but sapphire will take the lead from 2011 driven by the booming business in white LED for LCD backlight and general illumination.

These materials have been protected from silicon competition because they allow device performance not reachable by the semiconductor material (Frequency, power, thermal conductivity, robustness, junction temperature, voltage breakdown…). Even though compound materials have market prices dramatically higher than Si, Technical Specs have been, and will remain, the main driver for the adoption of these CS substrates and related technologies. All the considered materials are now available in a 4 inch format except bulk GaN that has just been released in 3 inch in Japan. This diameter expansion helps to lower the manufacturing cost of CS-based devices and to mass market affordable products.

This new report offers a unique panorama of the compound semiconductor substrate business in a single package. It highlights the main metrics and the key market trends that will help material and equipment vendors to position their R&D efforts and anticipate the changes and forecasted evolution of their business.

For each material (GaAs, GaP, GaN, SiC, InP and Sapphire), the report describes:

• The main targeted devices and related market size
• List and market shares of the main material suppliers (merchant and captive) with product description
• List and ranking of the main material users with final products description
• Substrate market value and volume ($, units, Msq.in.), split by diameter and electrical specs (Semi-conductive, semi-insulating) in the 2008-2013 time frame
• Overview of current developments and new innovations
• Projection of the CS materials market in 2013 and beyond.

COMPANIES CITED IN THE REPORT

Acme Corporation, AdTech, Agility, Alpha Crystal, Alphion, Ammono Sp, Anadigic, AOI, Avago, Avanex, AWSC, AXT, Bookham, Bridgestone, ComSeCore, Cotomat, Covega, Cree, Crysband, Crystal Applied Technology, Crystal On, Crystal Photonics, Crystal Q, Crystalwise, Cyoptics, Denselight, Denso, Dow Corning, Dowa, Elma Malachit JSC, Epistar, Epiworks, Eudyna, Exiton, Finisar, Freiberger, Fujitsu, Furukawa, GCS, GE, GigaCom, Goldeneye Inc., Hitachi (OpNext), Hitachi Cable, Hittite Microwave, HRL, II-VI, Iljin Display, Infinera, Inlustra Technologies LLC, InPACT, IntelliEPI, Intexys Photonics, IQE, JDSU, Juropol, Kopin, Kyma, Kyocera, Lumileds, LumiLOG, M/A-Com, Magnachip, Mimix Broadband, Mitsubishi Chemical, Mitsubishi Electric, MJ Corporation, Modulight, Monocrystal PLC, Multiplex, Namiki, NanoGaN Ltd., N-Crystals, NEC, Neomax, NeosemiTech, Nikko Materials / Acrotec, Nippon Steel, Norstel, Northrop Grumman, NTT, OKI, OMMIC, Ostendo, Oxford Inst. / TDI, PAM Xiamen, Panasonic, Peregrine, Phostec, Picogiga, Renesas, RMFD, Rohm, Rubicon, Saint-Gobain Crystals, Samsung-Corning, Santur, Sapphicon, Sapphire Technology, SEH, Sensor Electronic Technology: SET, Shinkosha, Showa Denko, SiCrystal, Silian, Sino American SAS, Skyworks, Sony, Soraa, Inc., Sumika, Sumitomo Electric SEI, Sumitomo Metal Mining, Svedice, TankeBlue, Tera Xtal Technology, Thales, TOPCO Scientific, TopGaN, TriQuint, UCSB, UMS, Unipress, Vitesse, VPEC, Wafer Tech. / IQE, Wafer Works, Win Semi, Xiamen Powerway, Xindium

Benefits of the report for equipment and material suppliers:

• Analysis of the structure of the compound semi material industry and evolution of the value chain
• Calculations of wafer volumes to be produced including diameter evolution for each market segments and each materials
• Description of the competing technologies using new materials with market penetration forecasts
• Listing and ranking of the key material makers with related market shares