Overview / Introduction
– Introduction
– Reverse Costing Methodology
Physical Analysis
– Physical Analysis Methodology
– Package
– Die Overview
– Guard Ring
– Passivation
– Metal Layer
– MOSFET Gate
– SIMS Analysis
– Substrate and Epitaxy
– Back Side
– Thickness Synthesis
– MOSFET Structure &Characteristics
–
Manufacturing Process Flow
– SiC Process Flow
– Description of the Wafer Fabrication Unit
Wafer Cost Analysis
– Wafer Cost data
– Yields Explanation
– MOSFET Unprobed Wafer Cost
– Wafer Cost per process steps
– Equipment Cost per Family
– Material Cost per Family
– Die per Wafer and Probe Test
– Probe Test
– Dicing and Package
– Final Test Cost
– MOSFET Die Cost
– Yields synthesis
Estimated Manufacturer Price Analysis
– Supply Chain Analysis
– Manufacturer ratios
– Estimated manufacturer Price
Conclusion