Yole developpement is proud to publish the reverse costing report of the Xlamp XR-C Cool White LED supplied by Cree. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

• The XLAMP XR-C Cool White series have a maximum brightness of 87.4lm with a consumption of 1.22W at 350mA.
•The component is provided in a specific 2-pins package, compatible with SMT process.
• It can be used in a wide range of lighting applications, including color-changing lighting, portable and personal lighting, outdoor and indoor directional lighting, commercial lighting and emergency-vehicle lighting. This report provides complete teardown of the LED with:
• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

• Analyze the cost of projects at the R&D level
• Enhance the negotiation power of purchasing managers
• Benchmark competitor’s products

Glossary................................................................................................................... p.3

1.Overview / Introduction..................................................................................... p.4

• Executive Summary
• Comparison of the analyzed LEDs
• Reverse Costing Methodology

2. Physical Analysis.............................................................................................. p.8

• Physical Analysis Methodology
• Package Characteristics
• Package X-Ray
• Package Opening
• Package Cross-Section
• Fluorescent Material
• Package Parameters Summary
• LED Dimensions
• LED Emission
• LED Cross-Section
• LED Structure

3. Manufacturing Process Flow......................................................................... p. 22

• LED Die Process Flow
• Description of the Wafer Fabrication Unit

4. Cost Analysis...................................................................................................... p. 26

• Synthesis of the Cost Analysis
• Yields Explanation
• LED Front-End Cost
• Front-End : Epitaxy Cost
• Front-End : Other Front-End Cost
• Dies per Wafer & Probe Test
• Back-End 0 : Probe Cost
• Back-End 0 : Dicing Cost
• LED Wafer & Die Cost (FE + BE 0)
• Back-End 1 : Packaging Process Flow
• Back-End 1 : Final Test Cost
• Component Manufacturing Cost (FE+BE0+BE1)
• Cost Analysis Evolution

5. Estimated Manufacturer Price Analysis...................................................... p. 48

• Price definitions
• Manufacturers financial ratios
• Binning Impact on Manufacturing Price
• Ideal manufacturer Price
• Manufacturing Price with Binning Yield

Conclusion