Yole Développement is pleased to publish the reverse costing report of the new generation of MEMS oscillator supplied by Discera. The DSC8002 is a programmable CMOS oscillator incorporating a Silicon MEMS resonator. Thanks to the TSV technology of Silex Microsystems (TSI™, Through Silicon Insulator), this new generation of Discera wafer-level packaged MEMS resonator achieves an area of ~0.3mm². The DSC8002 is available in industry standard packages (2.5 x 2.0 x 0.85 mm, 3.2 x 2.5 x 0.85 mm, 5.0 x 3.2 x 0.85 mm and 7.0 x 5.0 x 0.85 mm) and can replace standard crystal oscillators. This report provides complete teardown of the MEMS oscillator with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdownSelling price estimation

This report provides complete teardown of the MEMS oscillator with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

Glossary Overview

Introduction

• Executive Summary
• Reverse Costing Methodology

Discera Company Profile

• Product Range
• Business Model

Physical analysis

• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings
• Package Opening & Bonding Number
• Device Structure
• ASIC Markings
• ASIC Dimensions
• ASIC Minimal Dimension and Metal Layers
• ASIC Main Blocks
• MEMS Wafer-level packaging
• MEMS Resonator
• MEMS Cross-Sections
• MEMS process characteristics
• Comparison with previous generation

Manufacturing Process Flow

• Overview
• MEMS Process Flow
• Description of the Wafer Fabrication Unit

Cost Analysis

• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Yields Explanation
• ASIC Front-End Cost
• ASIC Back-End 0 Cost (Probe Test and Dicing)
• ASIC Die Cost
• MEMS Front-End Cost
• MEMS Front-End Cost per Process Steps
• MEMS Front-End : Equipment Cost per Family
• MEMS Front-End : Material Cost per Family
• MEMS Back-End 0 Cost (Probe Test and Dicing)
• MEMS Die Cost
• Back-End 1 : Packaging Cost
• Back-End 1 : Final Test Cost
• DSC8002 Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis

 Conclusion