Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have developed dedicated technologies and process IP in this area for years. Benefits of embedded package integration include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistic for OEMs.
Things are moving really fast at the moment as this year, we see both Fan-out wafer level packaging and chip embedding into PCB laminate infrastructures emerging at the same time, ramping to high volume production.
Fan-Out WLP technology is emerging on both 200mm / 300mm infrastructures
Infineon is having a great sucess with its proprietary eWLB technology: the first FO-WLP wafers are mass produced on 200mm both at Infineon, STATS ChipPAC and ASE since 2009. Indeed, Fan-Out WLP is extending the general concept of Wafer Scale Packaging to new application categories, especially the ones with higher pin-counts and larger chip size such as wireless communication ICs. First embedded package products based on eWLB have been identified within LGE and Nokia handsets. This year, a few additional players are even more aggressive in putting further capacity for eWLB manufacturing as both STATs chippaC and NANIUM are at the moment ramping-up their facilities for manufacturing the first generation eWLB on 300mm reconfigured wafers. Other packaging houses such as SPIL, Amkor, UTAC, ACET and others are also on the point to announce the start of their own Fan-out wafer level packaging operations.
Embedded die package technology to expand fast from niche to high volume markets
At the same time, embedded die package technology has made a lot of progress on its side. Based on PCB laminate infrastructure, chip embedding technology is actually on the way to catch a relatively important portion of the actual WLCSP packaging business as it does leverage the existing WLP/RDL infrastructure already established worldwide: indeed, most of WLCSP die applications are “embedded ready”, so to realize the full benefits of this “WLCSP to Embedded die” conversion, only a few extra manufacturing steps are missing like the realization of thin copper plating process, extreme wafer thinning down to 50μm, thin dies handling and dicing.
Electrical performance, testing and manufacturing yields are still major issues and showstoppers for chip embedding technology to move forward. Therefore, initial volume markets for embedded packages will be rather small, low pin-counts analog type of applications such as integrated passive devices (IPD), RFID and power MOSFET components that are at the moment under qualification for mass production before the end of this year already. Generally speaking, we believe that the winning situation for embedded die packages can be met for company partnerships able to cross-over the traditional packaging, assembly and test supply chain. A good example would be to put together a leading analog IC player (such as TI, Maxim IC, NXP or ST) with a WLP/RDL partner (such as FCI, Casio Micronics, NEPES, etc…) together with a PCB integrator player (such as Imbera / Daeduck, Ibiden, AT&S, Taiyo Yuden or SEMCO). This type of emerging partnerships are absolutely necessary in order to standardize the embedded package technology and to leverage an entire new packaging infrastructure based on low-cost, panel size PCB manufacturing techniques.
FOWLP versus Chip Embedding: competing technologies and infrastructures?
Today, embedded die and Fan-Out WLP technologies are not competing at all. Indeed, these two emerging semiconductor packaging techniques are targeting very different applications initially: the chip embeddeding technology is looking for replacement of low cost, low pin-counts WLCSP / SOT / QFN / LGA family package applications while FOWLP technology is rather targeting the direct replacement of higher I/Os (> 120 pins) BGA package applications. However, in the long term, with standardization and through further technology improvements towards higher yield, better electrical performance, lower profile, better testability and smaller pitch features, Fan-out WLP and Embedded die technology could seriously compete in the fast growing 3D Packaging market space as they will both enable the construction of ever more complex, larger SiP modules with different active and passive functions, all connected on both sides of the active substrate… So Fan-out WLP and chip embeddeding into PCB laminates are just two additional key pieces of the widening tool-box for 3D Packaging!
Both Fan-Out WLP and Chip embedded package technologies analyzed.
Key market drivers, benefits and challenges application by application
Market trends and figures with details breakdown by application
Description of the complete manufacturing BOM for embedded packaging:
key equipments: for 200 mm / 300mm / Panel manufacturing
Specific material's selection coming from both FE / BE / PCB area
Analysis of several embedded package target prices for a few key application
Supply chain perspectives, key players and emerging infrastructure for embedded packaging
Analysis of the different possibility for the implementation if FO-WLP and chip embedding with the rationale behind (chip first / chip last, single die / multi-die / SiP module, etc...)
WHO SHOULD BUY THE REPORT
• Integrated semiconductor Device Manufacturers and fabless semiconductor companies
- Benchmark the industrialization status of embedded packaging technologies within the industry
- Identify possible partnership /or second source packaging subcontractors for your forthcoming developments
• Assembly and Test Service companies
- Get the list of the main companies interested in Embedded WLP
- Screen possible new applications and technologies to support diversification strategy with embedded packaging platform
• Equipment and Material suppliers
- Understand the differentiated value of your products and technologies in this emerging but fast growing market
- Identify new business opportunities and prospects
• Electronic module makers and Original Equipment Makers
- Evaluate the availability and benefits of using embedded package components in your end system
- Monitor different embedded WLP suppliers to adjust your sourcing strategy
• PCB and IC substrate manufacturers
- Monitor the evolution of IC packaging, assembly and test, especially linked to the emerging chip embedding PCB-based technologies, FO-WLP, IPD and 3D interposers
Scope of the Report & Definitions3
• Objectives of the report
Executive Summary9
1 - Embedded die Packaging of active ICs and passive components 10
• Motivations and Drivers18
• Applications & End-markets:
• Status of commercialization 24
- Cell-phone & Consumer applications
- Automotive applications
- Medical applications
• 2009-2015 market forecasts for Embedded die packages 32
- In Package shipments (Munits)
- In Packaging revenues ($M)
• Supply chain emerging for embedded die packages 44
- Players and positioning in the electronic value chain
- Who is the most aggressive in the commercialization?
- Who is doing what: partnership identified
• Technology flavors for embedded package51
- Chip first versus chip last?
- Single die embedding versus SiP module?
> SiP multi-die integration
> Discrete passive integration
> Specific features integration (silicon interposers, holes,fluidic, hermetic cavities, etc…)
- Challenges related to yield & supply chain
• Equt & Material Tool-Box for Embeddeddie78
• Cost structure for Embedded packages manufacturing95
- Comparison with competitive package alternative that Embedded die technology is looking for direct replacement (QFN, BGA, WLCSP, SOT, PoP…)
- Cost structure target of Embedded die for different application case (RFID, IPD, Power MOSFET / IGBT, DC/DC converters, PMU, Wireless Connectivity ICs, Digital Baseband, Memories, etc …)
• Conclusion on “sweets spots” for the introduction of Embedded die technology in the short / medium / long term102
- Global Roadmap for Embedded die
2 - Fan-Out WLP package technology development120
• Motivations and market drivers
- Thermal performance of FOWLP package compared to FC-BGA package solution
• Applications & status of commercialization131
• 2009-2015 market forecasts for FOWLP type of packages 135
- In Package shipments (Munits)
- In Packaging revenues ($M)
• Supply chain emerging for FOWLP155
- Players and positioning in the electronic value chain
- Who is the most aggressive in the commercialization?
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