Glossary
Overview/Introduction
TDK-EPC Company Profile
Samsung Galaxy S3 Teardown
Physical Analysis
•Physical Analysis Methodology
•Package Characteristics & Markings
•Package X-Ray
•Package Opening – Main Parts
•Package Cross-Section
•Capacitor Switch Die
-Die Dimensions & Markings
-Die Overview & Details
-Die Cross-Section (die thickness, metal layers, MIM capacitors, JPHEMT transistors)
-Process Characteristics & Wafer Fab
•Phase Detector Die
-Die Dimensions & Markings
-Die Delayering
-Die Cross-Section (die thickness, metal layers, MIM capacitors, deep trench isolation, HBT transistors)
-Process Characteristics & Wafer Fab
Physical Analysis (cont.)
•Switch Controller Die
-Die Dimensions & Markings
-Die Delayering
-Die Cross-Section (die thickness, metal layers)
-Process Characteristics & Wafer Fab
•MCU die
-Die Dimensions & Markings
-Die Delayering
-Die Cross-Section (die thickness, metal layers
-Process Characteristics & Wafer Fab
Cost Analysis
•Synthesis of the Cost Analysis
•Yield Hypotheses
•Capacitor Switch Front-End Cost
•Capacitor Switch Die Cost
•Phase Detector Front-End Cost
•Phase Detector Die Cost
•Switch Controller Front-End Cost
•Switch Controller Die Cost
•MCU Front-End Cost
•MCU Die Cost
•Back-End: Packaging & Final Test Cost
•D7005 Component Cost (FE + BE)
Estimated Price Analysis