I-Micronews - View Report Epson Toyocom X3500W – QMEMS Gyro Reverse Costing Analysis

MEMS : Epson Toyocom X3500W – QMEMS Gyro Reverse Costing Analysis

Get into the secrets of Epson Toyocom X3500W – QMEMS Gyro

Price : 2490 €

Publication date : March 2010

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Physical Analysis of the Device

Step by Step Reconstruction of the Process Flow

Cost of Manufacturing and Estimation of Selling Price

Yole Developpement is pleased to publish the reverse costing report of the yaw rate sensor X3500W supplied by Epson Toyocom.

This Z-axis gyroscope use an hermetically sealed multi-chip Ceramic LCC package with two dies : a Quartz crystal sensor die processed with MEMS technology (QMEMS) and an ASIC die for signal conditioning.

The X3500W is integrated in the Nintendo Wii Motion Plus accessory. It is a variation of the standard XV-3500CB from Epson Toyocom which is mainly used for image stabilization of DVC and DSC or for the detection of moving with human machine interface.

This report provides a complete teardown of the QMEMS Gyroscope with:

• Detailed photos

• Material analysis

• Schematic assembly description

• Manufacturing Process Flow

• In-depth economical analysis

• Manufacturing cost breakdown

• Selling price estimation

•     Analyze the cost of projects at the R&D level

•     Enhance the negotiation power of purchasing managers

•     Benchmark competitor’s products

Glossary

Overview / Introduction

Epson Toyocom Company Profile

Physical Analysis

• Synthesis of the Physical Analysis

• Physical Analysis Methodology

• Package Characteristics & Markings

• Package Opening

• Device Structure

• ASIC Markings

• ASIC Dimensions

• ASIC Poly & Metal Layers

• ASIC Main Blocks

• ASIC Process Characteristics

• QMEMS Dimensions

• QMEMS Structure

• Gyro Principle : Double-T Structure

• QMEMS Details

• Component Cross-Section

• MEMS process characteristics

Manufacturing Process Flow

• Overview

• ASIC Process Flow

• MEMS Process Flow

Cost Analysis

• Synthesis of the Cost Analysis

• Main Steps of Economic Analysis

• Supply Chain Analysis

• Manufacturers financial ratios

• Yields Explanation

• ASIC Front-End Cost

• ASIC Back-End 0 : Probe Test and Dicing

• Die per wafer & Probe Test

• ASIC Total Wafer Cost (Front-End + Back-End 0)

• ASIC Die Cost

• QMEMS Front-End Cost

• QMEMS Front-End Cost per Process Steps

• QMEMS Front-End : Equipment Cost per Family

• QMEMS Front-End : Material Cost per Family

• QMEMS Back-End 0 : Test/Trimming

• QMEMS Back-End 0 : Bumping & Dicing

• QMEMS Total Wafer Cost (Front-End + Back-End 0)

• QMEMS Die Cost

• X3500W Packaging Process Flow

• X3500W Packaging Cost

• X3500W Final Test Cost

• X3500W Component Manufacturing Cost

• Yield Synthesis

Estimated Manufacturer Price Analysis

Conclusion

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