EQUIPMENT & MATERIALS SUPPLIERS OF FRONT-END AND BACK-END AREAS ARE FINDING BUSINESS
Demand for ‘mid-end’ tools and related materials is surging, thanks to the growth of 3DIC & Wafer-Level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2,5D interposers and Flip-chip wafer bumping.

• Large equipment suppliers coming from the semiconductor and front–end area who have expanded their business into the 3D TSV & WLP semiconductor business through acquisition of other companies.
• Equipment suppliers coming from niche application wafer processing markets with a broad product portfolio.
• “Specialist” equipment suppliers that have developed knowledge and expertise in very specific equipment lines.

The competitive landscape and market share for all main equipment & materials suppliers is quantified and detailed in this report.

COMPLETE TECHNOLOGIES UPDATE FOR EACH TYPE OF EQUIPMENT & MATERIAL USED IN 3D TSV & WLP APPLICATIONS
The wafer-level-packaging market remains a huge business opportunity and shows the greatest potential for significant future growth in the semiconductor industry.

• 2011-2017 wafer forecast for wafer-level-packages, with a unique market segmentation of the different flavors  currently blossoming in the “mid-end” of the semiconductor packaging supply chain: namely Flip-chip wafer bumping, WLCSP, FO WLP, 2.5D interposers and 3DICs with TSV interconnects.
• Detailed WLP & other technologies process flows/scenarios analysis, including evidence of the critical steps related to each wafer-level-packaging platform, and what the available technology alternatives are in the equipment & materials toolbox.
• WLP equipment & materials market forecasts in unit, volume and revenue from 2011-2017, and 2011 market share of all main equipment & materials suppliers per product line.
• An Excel DATABASE screening and profiling the activities of 375+ small, medium and large equipment & materials suppliers coming from either the Front-end/Back-end assembly/PCB/LCD/Solar industries and active in the 3DIC & WLP area

• Equipment & Materials suppliers
  • Assess the TAM – “Total Accessible Market” -- of your company’s related products in the wafer-level-packaging areas
  • Identify technology trends, challenges, and precise requirements for each 3DIC/WLP scenario
  • Screen competition activity and identify possible partnerships or targets for M&As in areas close to your current business
• R&D organizations & investors
  • Monitor  the global activity and consolidation currently occurring in the semiconductor equipment & materials business in order to identify new partners and targets, and make the right decision before committing to one particular supplier
• IDMs, CMOS foundries & OSAT players
  • Get an exhaustive list of the 375+ equipment & materials companies supplying solutions in the different  3DIC and wafer-level-packaging areas
  • Understand technology trends and benchmark several different 3DIC & WLP scenarios, including the future trends for PANEL scale packaging based on LCD/PCB infrastructures
• PCB substrate manufacturers
  • Access a complete list of semiconductor packaging equipment & materials companies supplying solutions in the blossoming 3DIC & wafer-level-packaging area
  • Identify technology trends, challenges and issues for each 3D packaging scenario