Glossary
1. Overview / Introduction…………………….…........…4
Glossary
Executive Summary
Reverse Costing Methodology
2. Company Profile…………....…………………………...6
Flir Profile
On Semiconductor
3. Physical Analysis………………………………......…...8
Synthesis of the Physical Analysis
IR Camera I7
Package 14
Package X-ray
Package front side
Package rear side
Read Out IC 27
ROIC Functions
ROIC technology
Micro-Bolometer 31
Reflector
Structure of Pixel
Microbridge
Contact structure
Compensation Pixels
Principle Operation
Physical data summary
4. Manufacturing Process Flow…………………………..….58
Global Overview
ROIC Process Flow
Description of the ROIC Wafer Fabrication Unit
Micro-bolometer Process Flow 62
Description of the Micro-Bolometer Wafer Fabrication Unit
Packaging 73
5. Cost Analysis………………………………..…………..…..74
Main Steps of Economic Analysis
Yields Explanation
Die per wafer & Probe Test
ROIC Wafer Front-End Cost
6. 200mm Micro-Bolometer Cost Analysis……………..…..80
Micro-Bolometer Wafer Cost
Micro-Bolometer Step Cost
Micro-Bolometer Equipment Cost
Micro-Bolometer Consumable Cost
Back-End 1 : Packaging, Final test 86
Component Cost (FE + BE 0 + BE 1) 93
Yields Synthesis
7. Micro-Bolometer Price Estimation…….……………..…..96
Manufacturer Financial Ratios
Estimated Manufacturer Price
Synthesis of the cost analysis
Conclusion ………………………………….…………………101