Market trends
Ferroelectric thin films have been used for many years in Integrated Passives Devices (IPDs), Ferroelectric memories (FeRAM) and MEMS inkjet heads. Such thin films can be used for ferroelectric, piezoelectric or pyroelectric properties.
Ferroelectric materials were considered as exotic materials in the past in the semiconductor domain. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field: MEMS wafer level autofocus, RF MEMS, MEMS ultrasonic transducers infrared sensors, IPD tunable capacitors, and many others.
Physical Vapor Deposition is the dominant deposition technique but Chemical Solution Deposition techniques will increase its market share greatly, especially in MEMS applications thanks to its better material composition. PZT, the most well-known ferroelectric material will keep the leadership on SBT, BST, except if other materials are developed to replace lead, black listed by the RoHs European directive.
Market metrics
Driven by existing and new applications, the production of ferroelectric thin films will grow from 881,000 6’’ eq. wafers in 2010 to 1,263,000 wafers in 2015, meaning a CAGR of +7.5 %. Inkjet head application and IPDs ESD/EMI planar capacitor represent more than 90% of the production in 2010 but other applications will grow strongly to reach globally 26% of the total production. Large industrial companies are already using ferroelectric thin films in various applications fields, showing the reliability of this technology:
- IPDs : NXP, STM
- MEMS : EPSON
- FeRAM : Panasonic, Fujitsu, Rhom, Oki, Ramtron
In the next 5 years, many new players plan to adopt or evaluate ferroelectric thin films to enter on key markets, from SMEs (Polight, Irisys, NovioMEMS…) to large groups (Océ, Xaar, Delphi, IBM, Philips research…).
The objectives of the report
- Provide an overview of the ferroelectric thin film applications
- Description of the key ferroelectric thin film applications
- Who are the current and future industrial ferroelectric thin film users is each application
- Main trends regarding the use of thin films
- Analyze the deposition techniques and materials (PVD, CVD, CSD) trends
- Deposition techniques used in each application and for each manufacturer
- Global deposition techniques and material trends
- Provide production data on ferroelectric thin film business
- Ferroelectric thin film production forecast 2010-2015 in number of wafers
- Market shares of the different detection techniques globally and by applicati
- Market shares of the ferroelectric material
Who should buy the report
- Device (MEMS, IPDs, FeRAM…) manufacturers
- Evaluate the benefits of using ferroelectric thin films technologies
- Identify new business opportunities and partners
- Monitor and benchmark your competitor’s advancements in thin films developments
- Evaluate market potential of future technologies and products for new applicative markets
- Identify the best candidates for technology transfer
- MEMS & packaging foundries
- Understand ferroelectric thin films applications and the deposition techniques used
- Identify new business opportunities and prospects
- Thin films equipment (CVD, PVD, CSD, characterization systems..) and materials manufacturers
- Evaluate market potential of ferroelectric thin film business with major applications and trends
- Identify new business opportunities and partners
- Financial & strategic investors
- Understand the potential of ferroelectric thin films business
- Get the list of main key players and emerging start-ups of this industry
Companies mentioned in the report
Argonne lab, Asicon, Avx, BAE, Brother, CEA Le Ripault, Cranfield University, Deplhi, DRS, Epcos, EPFL, Epichem, Epiphotonics, EPSON, FLIR, Fraunhofer IMT, Fraunhofer IPMS, Fujifilm Dimatix, Fujitsu, Gennum, Hammamatsu, Heimann, Holst centre, Hynix, IBM, Imagine Optic, IMEC, Infineon, Inostek, Ipdia, Irisys, KIST, Kojundo lab, Korean Institute of Technology, KTH, L3Com, LAAS, Lemoptix, Lensvector, LG, Matsushita, Maxim, Microsystem lab, Microvision, Mitsubishi Chemical, Murata, Nippon Ceramic, NovioMEMS, NovioMEMS, NXP, Oce, Oerlikon, OKI, Olympus, ON semiconductor, Onchip, Panasonic, Panasonic, Paratek, Philips, Philips Research, Polight, Pondus Instruments, Pulse, Pyreos, Pyreos, Ramtron, Rohm, Samco, Samsung, Semtech, Siemens Medical, Singapore univ, Sintef, Solmates, Sonitor, Sound Design Technology, Steinbeis Transfer centre, ST microelectronics, Suss, Symetrix Corporation, Tango, Technolas perfect vision, Tegal, Texas Instrument, Tezzaron, Thales, Toshiba, Tyndall, Ulis, Ulvac, US Army lab, Vermon, VTT, Western digital, Wispry, Xaar
RSS FEEDS
New MEMS applications are broadening the traditional Inkjet, IPDs and FeRAM scope of ferroelectric thin films