Glossary

Overview/Introduction                   p4

•        Executive Summary

•        Reverse Costing Methodology

Freescale Company Profile                     p8

Physical Analysis                          p12

•        Synthesis of the physical analysis

•        Physical analysis methodology

•        Tire Pressure Monitoring System (TPMS)

•        Multi-Chip Package

•        Package characteristics & markings

•        Package opening – Bondings Number

•        Package opening – Encapsulation

•        MCU markings

•        MCU dimensions

•        MCU minimal dimension and metal layers

•        MCU process characteristics

•        RFX markings

•        RFX dimensions

•        RFX minimal dimension and metal layers

•        RFX process characteristics

•        G-die markings & dimensions

•        G-die : cap opening

•        G-die : sensors dimensions

•        G-die : x-axis structure

•        G-die : x-axis process characteristics

•        G-die : z-axis structure

•        G-die : z-axis process characteristics

•        G-die process characteristics

•        P-die markings

•        P-die dimensions

•        P-die minimal dimension and metal layers

•        P-die : sensors dimensions

•        P-die : “Sense” sensor process characteristics

•        P-die : “Reference” sensor process characteristics

•        P-die process characteristics

Manufacturing Process Flow                p56

                    •        Overview

                    •        MCU process flow

                    •        RFX process flow

                    •        G-die process flow : sensor wafer

                    •        G-die process flow : cap wafer

                    •        P-die process flow : ASIC

                    •        P-die process flow : Sensor

                    •        Description of the Wafer Fabrication Units

Cost Analysis                                          p68

•        Synthesis of the cost analysis

•        Main steps of economic analysis

•        Yields explanation

•        MCU wafer cost

•        MCU probe & dicing cost

•        MCU die Cost

•        RFX wafer cost

•        RFX probe & dicing cost

•        RFX die cost

•        G-die wafer cost

•        G-die wafer cost per step

•        G-die probe & dicing cost

•        G-die die cost

•        P-die wafer cost

•        P-die wafer cost per step

•        P-die probe & dicing cost

•        P-die die cost

•        MPXY8300A packaging cost

•        MPXY8300A final test cost

•        MPXY8300A component manufacturing Cost

•        Yield synthesis

Estimated Manufacturer Price Analysis           p100

•        Supply Chain Analysis

•        Manufacturer ratios      

•        Estimated manufacturer Price

Conclusion