MARKET TRENDS

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPD’s) are now a growing industry trend driven by ESD/EMI protection, RF, High Brightness LEDs, Digital & Mixed Signal applications.

Yole’s new research study on Thin-film Integrated Passive and Active devices estimates the total IPD market to grow from more than $600M this year to over $1B by 2013. Whether it is to reduce space on the application board, to enhance performance or to reduce cost at the system level, IPD’s are spreading to most electronic sectors, from low volume to mass market businesses in aerospace, military, medical, industrial, lighting, communications, and PC applications.

Over the past few years, IPD’s have become an essential enabler of System-in-Packages (SiP) realizations. Looking to tomorrow, IPD’s are paving the way to the bright future of the “More than Moore” heterogeneous integration as they contribute greatly to bridging the increasing gap between the evershrinking geometries of CMOS IC’s and the lagging packaging technologies. IPD’s enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units and digital processors. 

At the frontier between the back-end and the front-end of the semiconductor industry, Thin-film IPD’s are poised to extend the use of Wafer-Level Packaging (WLP) and Through silicon Via (TSV) technology platforms to many IC package solutions as well as to the discrete passive component industry. Being a “bridge platform”, IPD’s involve the complete semiconductor value chain: equipment; material providers; fabless semiconductor players; integrated device manufacturers; CMOS foundries; MEMS players; substrate suppliers; and OSAT industry, are all concerned by the need to increase their value proposition in the future through the extensive integration of thin film integrated passive and active devices. In this report, you will find comprehensive links between the different IPD technologies and each of their applications. Market share, supply value chain and strategies of the current major players and those looking at entering this business have been identified.

IPD technology trends, manufacturing options and challenges to be addressed are discussed and detailed. Finally, a complete market segmentation for the commercialization of IPD’s is proposed.Market forecasts and attached growth rates for each segment are provided for 2008-2015.

KEY FEATURES OF THE STUDY

• Four application fields investigated (ESD/EMI protection, HB-LED silicon submounts, RF and Digital & Mixed signal IPD)

• Market trends and figures provided both in M$, Munits and wafer size equivalent

• Complete technologies and material tool-box analysis

• 30 detailed company profiles of key IPD players

• 320+ pages

This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report not only describes the market and the associated technologies deep inside the applications, but it also provides a broad overview of the thin-film IPD market and its forthcoming growth opportunities.

–        Each market sub-segment is exhaustively detailed with:

• Drivers and benefits of IPDs

• Sub-segment size and expected growth rate

• Value chain analysis

• Global market evaluation per application: volume in units, wafers, and market size ($).

• Evaluation of the major market players (market share)

 Companies cited in the report:

AMD, ATI, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, Bourns, Bridgelux, CMD, Cree, CSR, Kyocera, Fairchild, Flip-Chip International, Fraunhofer Institutes, Freescale, Fujikura, Hymite, Ibiden IBM, IMEC, Infineon, ipdia, Ibiden, IME, IMEC, ITRI, Jazz Semiconductor, KST-World, Qualcomm, Leti, LG Innotek, Lumileds, Maxim IC, Micron, Murata / SyChip, National Semiconductor, Nichia, NEPES, Nokia, NXP, OnChip Devices, On Semiconductor, Paratek, RFMD, Shinko, Silex Microsystems, Skyworks, Semtech, STATSChipPAC, STMicroelectronics, SPIL, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Thales, Touch Microsystems Technology, Toshiba, Triquint, Tyndall, UMC, Vishay, Wavenics, Wispry, Zarlink and more…

KEY FEATURES OF THE STUDY

• Four application fields investigated (ESD/EMI protection, HB-LED silicon submounts, RF and Digital & Mixed signal IPD)

• Market trends and figures provided both in M$, Munits and wafer size equivalent

• Complete technologies and material tool-box analysis

• 30 detailed company profiles of key IPD players

• 320+ pages

 BENEFITS

This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report not only describes the market and the associated technologies deep inside the applications, but it also provides a broad overview of the thin-film IPD market and its forthcoming growth opportunities.

–        Each market sub-segment is exhaustively detailed with:

• Drivers and benefits of IPDs

• Sub-segment size and expected growth rate

• Value chain analysis

• Global market evaluation per application: volume in units, wafers, and market size ($).

• Evaluation of the major market players (market share)

WHO SHOULD BUY THE REPORT

• IPD manufacturers

- Evaluate market potential of your technologies and products

- Position your company in the value chain and market

- Monitor and benchmark your competitors

• Integrated semiconductor Device Manufacturers

- Get the list of the top IPD players to define your own IPD strategy for System-in-a-Package integration.

• Assembly and Test Service companies

- Get the list of the top IPD players to define your own IPD strategy for System-in-a-Package integration.

• Electronic module makers and Original Equipment Makers

- Evaluate the benefits of using these new technologies in your end system.

- Select new suppliers.

• Equipment and Material manufacturers

- Identify new business opportunities and prospects

- Understand the differentiated value of your products and technologies in this market

• PCB manufacturers

- Understand the complementarities of IPD’s with PCB’s and define differentiated partnerships

• Discrete component makers

- Understand the complementarities of IPD’s with PCB’s and define differentiated partnerships

• Financial and strategic investors

- Understand the potential of the IPD technologies and its players

• Foundries

- Spot new opportunities and define diversification strategies

• Overview of discrete versus integrated passives solutions

• Integrated active and passives structures definitions (inductor, capacitor, resistors, diodes, combinations…)

• Comparison between thin film / thick film IPD technologies (including ceramic LTCC)

 2. Thin film IPD applications and market drivers P35

• IPD categories (ESD/EMI protection IPD, high brightness LED silicon submount, RF IPD, Digital & Mixed Signal IPD)

• IPD current and future applications

• IPD benefits and market drivers description for each IPD category and application

 3. Thin film IPD Market status and 2008-2015 forecasts P67

• IPD market forecasts are provided both in M$, Munits and in wafer eq. with attached growth rates

- Volume shipments for IPD per applications (cell-phone, mp3 players, medical, automotive…)

- IPD shipments per category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)

o Specific applicative breakdown and forecasted evolution for each category

- IPD shipments per substrate type (Silicon, Glass, GaAs, SOI…) and wafer size (4” / 6” / 8” / 12”)

- IPD shipments per integration choice (discrete, Above IC, SiP package…)

- IPD shipments per packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…

• IPD player market shares and revenues

- “Top 15” IPD players 2008 revenues

- Overall players market shares based on 2008 IPD revenues

o Specific market share breakdown for ESD/EMI protection IPD applications

– Specific market share breakdown for RF IPD applications

 4. Thin film IPD technologies P95

• IPD components requirements and technology options

- Performance and integration capabilities

o Inductors (multilayer planar inductors, 3D inductors…)

o Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)

o Others structures (resistors, diodes…)

• IPD Manufacturing challenges and related equipment & material tool-box

- Substrate choice technology comparisons: high resistivity Silicon / Glass / SOI / GaAs / Plastic laminate

- Dielectric layers options (low k / high k)

o Available photoresists, oxide and other layer solutions, impact of layer thickness

- Metallic layers formation (Al, Copper, Gold…)

o Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)

• IPD Design, Simulation and predictability through system level co-design

 5. Thin film IPD architectures, assembly & packaging P148

• Integration, packaging and assembly platforms options for IPDs

• Through silicon Via manufacturing: a necessary step to reach the 3rd dimension

• Fan-Out Wafer level packaging and embedded die concepts

• Overall IPD Technology roadmap

 6. Thin film IPD Supply chain & Players P172

• Geographical mapping of different players

• Business models analysis for IPD (speciality foundries, Integrated Device Manufacturers, Turnkey packaging providers, module makers, fabless & end integrators)

• Summary of IPD players capabilities (manufacturing, design/library, packaging & assembly…)

• Present and future challenges ahead for successful commercialization of IPDs

 7. Conclusions & Perspectives  P223

 8. "Top 30" COMPANY PROFILES

APM / UMC, ASE, AVX / Kyocera, CMD, Flip-Chip International, Fujikura, IBM, IMEC, Infineon, ipdia, ITRI, KST-World, Leti, LG Innotek, Murata / Sychip, NXP, OnChip Devices, On Semiconductor, Replisaurus, Shinko, Silex Microsystems, STATS ChipPAC, STMicroelectronics, Telephus / SEMCO, Touch Microsystems Technology and more...