Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement is proud to publish the reverse costing report of the enhanced Wafer Level BGA (eWLB) package used in the X-GOLD™ 213 circuit from Infineon.
eWLB is a Ball Grid Array package based on the emerging Fan-Out Wafer Level Package (FO-WLP) concept. All the packaging operations are done at the wafer level, and a fan-out area is provided, which extends the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls 8x8 mm package.
The eWLB is manufactured on 200 mm wafers by Infineon who licensed the technology to ASE and STATSChipPAC.
This report provides for a complete teardown of the X-GOLD 213™ eWLB package including:
• Detailed photos
• Material analysis
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation