I-Micronews - View Report InvenSense IDG-600/650 2-Axis Gyroscope Reverse Costing Analysis

MEMS : InvenSense IDG-600/650 2-Axis Gyroscope Reverse Costing Analysis

Get into the secrets of the InvenSense 2-Axis Gyroscope

Price : 2490 €

Publication date : February 2010

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Physical Analysis of the Device

Step by Step Reconstruction of the Process Flow

Cost of Manufacturing and Estimation of Selling Price

Yole Developpement is pleased to publish the reverse costing & engineering process analysis of the famous Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense.

The IDG-600, integrated in the Nintendo Wii Motion Plus accessory, and its standard variation the IDG-650 share the same hardware. The components are manufactured using a three-bonded-wafer process: a thin sensor wafer and a protective cap wafer processed with bulk micromachinning and an ASIC wafer for signal conditioning.

The IDG-600/650 gyroscopes are suitable for high performance motion sensing game controllers, pointing devices, multimedia remotes and computer mice applications.

This report provides complete teardown of the MEMS Gyroscope with:

Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth economical analysis
Manufacturing cost breakdown
Selling price estimation

•     Analyze the cost of projects at the R&D level

•     Enhance the negotiation power of purchasing managers

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Glossary

Overview/Introduction

• Executive Summary

• Reverse Costing Methodology

InvenSense Company Profile

• Product Range

• Business Model

Physical analysis

• Synthesis of the Physical Analysis

• Physical Analysis Methodology

• Package Characteristics & Markings

• Package Opening & Bonding Number

• IDG-600 / IDG-650 Comparison

• Device Structure

• Device Dimensions

• ASIC Markings

• ASIC Minimal Dimension and Metal Layers

• ASIC Main Blocks

• ASIC Process Characteristics

• MEMS Markings

• MEMS Sensor IR View

• MEMS Sensor Details

• Component Cross-Section

• MEMS process characteristics

Manufacturing Process Flow

• Overview

• ASIC Process Flow (CMOS + Cavity Etch)

• MEMS Process Flow (Cap + Sensor + Assembly)

Cost Analysis

• Synthesis of the Cost Analysis

• Main Steps of Economic Analysis

• Supply Chain Analysis

• Manufacturers financial ratios

• Yields Explanation

• ASIC Front-End Cost

• MEMS Front-End Cost

• MEMS Front-End Cost per Process Steps

• MEMS Front-End : Equipment Cost per Family

• MEMS Front-End : Material Cost per Family

• Total Front-End Cost (ASIC + MEMS + Assembly)

• Back-End 0 : Probe Test and Dicing

• Total Wafer Cost (Front-End + Back-End 0)

• Die cost

• Packaging Cost

• Final Test Cost

• Component Manufacturing Cost

• Yield Synthesis

Estimated Manufacturer Price Analysis

Conclusion

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