Yole Développement is proud to publish the reverse costing report on the MPU 6000 MEMS from Invensense.
The MPU 6000-6050 is the first inertial MEMS that combines a 3D accelerometer and a 3D gyroscope in the same silicon substrate together with a signal conditioning circuitry in a 4x4x0.9 mm³ QFN package.

The MPU 6000/6050 is targeted  for mobile phones, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

•  Detailed photos
•  Material analysis
•  Schematic assembly description
•  Manufacturing Process Flow
•  In-depth economical analysis
•  Manufacturing cost breakdown
•  Selling price estimation

• 1. Introduction
  • Executive Summary
  • Reverse Costing Methodology
• 2. Company Profiles
• 3. Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings     
  • Package X-Ray
  • Package Opening
  • Package Cross-Section
  • Device Structure       
  • Die Dimensions
  • MEMS Sensor       
  • MEMS Sensor -3-Axis Gyroscope
  • MEMS Sensor -3-Axis Accelerometer
  • ASIC Marking       
  • ASIC Bond Pad
  • ASIC Cavities
  • Component Cross-Section   
  • Physical Data Summary
• 4. Manufacturing Process Flow
  • Global Overview
  • ASIC Process Flow       
  • MEMS Process Flow   
  • Description of the Wafer Fabrication Units
• 5. Cost Analysis
  • Synthesis of the Cost Analysis
  • Yields Explanation
  • ASIC Front-End Cost ( CMOS+ Cavities)
  • MEMS Front-End Cost   
  • MEMS Wafer : Equipment Cost per Family
  • MEMS Wafer : Consumable Cost per Family
  • Total Wafer Cost       
  • MEMS Die cost
  • Component Packaging Cost    
  • Component Final Test Cost
    
• 6. Estimated Price Analysis
  • Manufacturers financial ratios   
  • Estimated manufacturer Price
  • Estimated Selling Price