The latest Teardown & Reverse Costing MPU-9150 MEMS from InvenSense.

Yole Développement is pleased to publish the reverse costing report on the MPU-9150 MEMS from InvenSense.
The MPU-9150 is a motion tracking MEMS that combines a 3D accelerometer, a 3D gyroscope from Invensense and a 3D digital compass from AKM in the same package, a 4x4x1mm LGA package.

The MPU-9150 is targeted  for mobile phones, tablets, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

• Overview / Introduction p 3
  • Executive Summary
  • Reverse Costing Methodology
• Company Profile p 5
• Physical Analysis p 13
  • Synthesis of the Physical Analysis
  • Physical Analysis methodology
  • Package characteristics & markings
  • Package opening
  • Package Opening : Dies Bonding
  • Package Cross Section
  • Invensense ASIC Marking
  • Invensense ASIC Dimensions
  • Invensense ASIC minimal dimensions
  • Invensense ASIC Cross section
  • Invensense ASIC Process Characteristics
  • Invensense MEMS marking
  • Invensense MEMS Opening
  • Invensense MEMS Sensing Area
  • Invensense MEMS Cap
  • Invensense MEMS Process Characteristics
  • Magnetometer marking
  • Magnetometer Dimensions
  • Magnetometer Cross Section
  • Magnetometer Process Characteristics
• Manufacturing Process Flow p 82
  • Global view
  • Process Flow Accelerometer ASIC
  • Process Flow MEMS Accelerometer
  • Process Flow Magnetometer
  • Process Flow Packaging
  • Description of the Wafer Fabrication Unit
• Cost Analysis p 100
  • Synthesis of the cost analysis
  • Methodology
  • Hypothesis
  • Yield Synthesis
  • Invensense ASIC Wafer Cost
  • Invensense ASIC Die Cost Data
  • MEMS Accelerometer Wafer Cost
  • MEMS Accelerometer cost per Steps
  • MEMS Accelerometer Equipment cost
  • MEMS Accelerometer Material cost
  • MEMS Accelerometer Die Cost
  • Magnetometer Wafer Cost
  • Magnetometer cost per Steps
  • Magnetometer Material cost
  • Magnetometer Die Cost
  • Back-End : Package Cost
  • Back-End : Package Cost Per Steps
  • Back-End : Package Material cost
  • Back-End : Final Test
  • MPU9150 Manufacturing Cost
  • Cost Analysis Evolution over yield
• Estimated Selling Price Analysis p 146
  • Supply Chain Analysis
  • Estimated Selling Price
  • Price Evolution according to the yield
  • Glossary
  • Contacts