Glossary
       
Overview/Introduction               p4

•  Executive Summary
•  Reverse Costing Methodology

Knowles Company Profile          p8

•  Product Range
•  Manufacturing Units
•  Business Model

Physical Analysis                         p12

•  Synthesis of the Physical Analysis
•  Physical Analysis Methodology
•  Package Characteristics & Markings
•  Package X-Ray
•  Package Top Cover
•  Package Composition
•  Package Opening & Bonding Number
•  ASIC Markings
•  ASIC Dimensions
•  ASIC Minimal Dimension and Metal Layers
•  ASIC Transistor Details
•  ASIC Process Characteristics
•  Microphone Markings
•  Microphone Details
•  Microphone Dimensions
•  General Dimensions
•  Diaphragm Dimensions
•  Back Plate Holes Dimensions
•  Back Plate Support Post Dimensions
•  Microphone Structure
•  Microphone Cross-Section
•  Overview
•  DRIE Scallops
•  Layers Thickness
•  Microphone process characteristics

Manufacturing Process Flow        p46

•  Overview
•  ASIC Process Flow
•  Microphone Process Flow
•  Description of the Wafer Fabrication Units

Cost Analysis                                  p51

•  Synthesis of the Cost Analysis
•  Main Steps of Economic Analysis
•  Yields Explanation
•  ASIC Wafer Cost Hypothesis
•  Asic Wafer Cost
•  ASIC Probe & Dicing cost
• ASIC Die Cost
•  Microphone Wafer Cost Hypothesis
•  Microphone Wafer Cost
•  Microphone Wafer Cost  Breakdown per Steps
•  Microphone Wafer : Equipment Cost  Breakdown
•  Microphone Wafer : Equipment Cost per Family
•  Microphone Wafer : Material Cost  Breakdown
•  Microphone Wafer : Material Cost per Family
•  Microphone Probe & Dicing Cost
•  Microphone Die cost
•  SPM0408 Packaging Cost Hypothesis
•  SPM0408 Packaging Cost
•  SPM0408 Packaging Cost per Steps
•  SPM0408 Final Test Cost
•  SPM0408 Component Manufacturing Cost
•  Yield Synthesis
•  SPM0408 Cost Analysis Evolution

Estimated Manufacturer Price Analysis  p76

•  Supply Chain Analysis
•  Manufacturers ratios   
•  Estimated manufacturer Price

Conclusion