Content
Introduction
Executive summary
Acronyms & definitions
LED market status
· Market segmentation
· Market Volume
· Market Revenue
· General Lighting
· GaN-based White LEDs
· Wafer Needs for General Lighting
LED Performance
· Lumens. Depending on Applications
· Internal Quantum Efficiency
· Evolution Under High Current
· Output Heat
· Overall Performances
· Expected Performances for White LED
LED Packaging Status
· Introduction
· Package families
· Assembly Process Flow
o Definitions
o Description
o System Integration
o Challenges
o Value Chain
o Evolution
o Trends
· Technology Roadmap
Packaging of Regular LED
· Flow Chart for Regular LED
o Main steps and materials
o Standard Assembly Flow
o Through Hole Devices
o Surface Mount Devices
o Market Metrics - Packaged LED Market Volume
· DICING
o Location of Dicing Process
o Saw Dicing
o Laser Dicing
o Saw VS Laser
o Supply Chain
o Market Volume for Sapphire Wafers
o Market Revenue for Dicing Services
o Market of equipments in number of units
o Market in $M
· DIE BONDING
o Location of the process
o The Basics
o Dispensing equipment from Asymtek
o Material for LED
o Main players
o Market Volume for Die Attach Material
o Market Revenue for Die Attach Material
o Market of equipments in number of units
o Market of equipments in $M
· INTERCONNECT
o Location of the process
o Overview of wire bonding
o Electrical connection : the basics
o Wire Bonding Processes
o Ball bonding VS Wedge bonding
o Ribbon bond VS wire bond
o Main players
o Market revenue - Assumptions
o Market revenue for gold wire bonding
· ENCAPSULATION, LENS & PHOSPHOR
o Location of the process
o Encapsulation method for LED lamp
o Casting process for encapsulation
o Encapsulation for SMD
o Compression molding process
o Materials for encapsulation
o Market estimation of molding compound
o How does LED generate white light?
o Phosphor chemistry
o Phosphor placement in white LED
o Main phosphor technologies in use
o Main phosphor suppliers
o Optics
o Main players
o Market revenue for phosphor material
· CONCLUSIONS
PACKAGING OF HB/UHB LED
· Introduction
· What package for what LED?
· Package type
· Evolution of the packaging
· Impact of the heat
· HB/UHB LED packaging function
· Different levels of packaging
· Considerations of HB LED design
· Materials challenges and solutions
· Market Metrics - Packaged LED Market Volume
· SCRIBING AND DICING
o Location of the process
o Scribing & Dicing: Definition
o Techniques, Throughputs and Costs
o Number of dice / wafer
o Laser Scribing & Dicing
o Diamond Scribing & Dicing
o Example of JPSA Scribing & Dicing tool
o Example of NWR Scribing & Dicing tool
o Laser Microjet Technology from Synova
o Example of Synova Scribing & Dicing tool
o Example of Oxford Lasers Scribing & Dicing tool
o Example of ALSI Lasers Dicing tool
o Stealth Dicing Technology
o Stealth Dicing Roadmap
o Example of Stealth Laser Dicing tool
o Example of Jenoptik-Votan dicing tool
o Market Data - Assumptions
o Laser vs saw
o Market Revenue for HB/UHB LEDs
o Market of equipment in number of units
o Market revenue of equipments in $M
· DIE BONDING
o Location of the process
o Choosing die attach material
o New material for HB/UHB LED - AuSn
o AuSn – Strength and weakness of deposition methods
o Summary
o Market Volume for Die Attach Material
o Market Revenue for Die Attach Material
o Market in number of die bonding equipment
o Die bonding equipment – market in $M
· INTERCONNECT
o Location of the process
o What’s new?
o Evolution in wirebonding
o Matrix LED – features
o Flip Chip Technology
o Wirebond VS Flip Chip
o Flip-chip coupled with back-face contact reflector
o Stud Bumping
o Example of Lumileds Luxeon K2
o Laser Lift-Off (LLO) & Flip-Chip
o Laser Lift Off Technique: definition
o Laser Lift Off Technique: OSRAM
o LLO equipment
o LLO technique & Flip-chip mounting
· TEMPORARY BONDING
o introduction
o Thin-wafer handling: different solutions
o principle
o Main methods: a comparison
o wax
o adhesive tapes
o EVG temporary bonding tools
· THERMAL MANAGEMENT
o Location of the process
o Thermal Solutions
o Thermal solutions - Managing the LED Thermal System Configuration
o Substrates
o Substrates - SMD organic
o Substrates - Metal Core Printed Circuit Board
o Substrates - FR4 Board & Flexible Substrate
o Substrates - Ceramic Substrates
o Substrates - Direct Bonded Copper
o Substrates – Trends for DBC
o Substrates - Summary
o Substrates – Trends : Chip On Board
o Substrates – Main Players
o Substrates – Market Data
o Substrates – Market Volumes
o Substrates – Market Revenue
o HB LED submount – Market Breakdown
o HB LED submount – Supply Chain
o Thermal Interface Material
o Thermal Interface Material – Main Players
o Heatsink
o Heatsink – Main Players
o Summary – LED Package with optimized heat transfer
· ENCAPSULATION, LENS & PHOSPHOR
o Location of the process
o Optical extraction techniques
o Remote phosphor
o Silicon Product - Shin Etsu
· WAFER LEVEL PACKAGING
o Main challenges for Power LED WLSP
o Market drivers – Power LED Packaging
o Power LED Packaging Manufacturer Motivations & Segmentation
o 3D-TSV developments for Power LEDs
o Overview of power LED packaging types
o Drivers for LED silicon packaging solutions
o Supply chain focus on ESD protection using Si submounts for HB LEDs
o Hymite: Silicon HB-LED packages
o Silicon interposer for MEMS / LED Applications
o 3-D interposer to combine MOSFET + ASIC LED driver
o WLP : VisEra technologies
o Estimation of 6” Silicon wafer demand for LED submount and WLP
o Conclusion & challenges
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LED market analysis report with detailed descriptions of process, equipment and materials for LED assembly.