Due to their non-standard manufacturing process, the cost of MEMS devices can be difficult to estimate. Components such as accelerometers, pressure sensors, inkjet heads or micromirrors involve very different process steps.
MEMS Cosim+ is a flexible tool ready to evaluate the cost of any MEMS process or complexed packaged device, already used by manufacturers as well as end users.
With the possibility to store steps and process flows in libraries, this new version dramatically reduces the duration of the cost evaluation.
Multiple process flows
Any MEMS process flow can be simulated.
Hierarchical description for multiple dies or processes.
Simulate cost for a variety of different conditions (region, clean room class, process type, etc).
Possibility to store an unlimited number of process steps or process flows in libraries.
Simulation of up to five simultaneous scenarios allowing the user to run sensitivity analysis and compare results like yield improvement, manufacturing location impact on cost, etc.
Multiple subcontracting operations
Costs of usually externalized operations can be precisely evaluated by setting their individual regional and commercial parameters.
No admin privilege is required for setup
MEMS Cosim+ is working from a single MS-Excel™ file and an external and sharable data file.
Requires only basic MS-Excel ™ or MS-Office™ suite (from 2003 to 2010 release)
Results are fully open-format
You can modify or export final results, and build reports your own style as with any Excel workbook.
All the data managed by IC Price+ are stored in an external MS-Access™ database file. Data cannot be read from the single Excel file and access rights to the database are needed. Multiple access, data sharing and data integrity are secured.
MP11 - STMicroelectronics THELMA process
MP12 - Bosch surface micromachining process
MP13 - Kionix dry micromachining process
MP14 - Analog Devices iMEMS process
MP34 - Analog Devices SOI micromachining process
MP15 - MEMSIC CMOS/MEMS process
MP16 - Freescale surface micromachining process
MP36 - Freescale HARMEMS process
MP17 - VTI 3D-MEMS process for automotive
MP37 - VTI 3D-MEMS with SOI process for automotive
MP18 - VTI 3D-MEMS process for consumer
MP19 - Sensonor bulk micromachining
MP21 - STMicroelectronics THELMA process
MP22 - Bosch surface micromachining process
MP23 - InvenSense Nasiri Process
MP24 - Epson Toyocom QMEMS process
MP25 - Silicon Sensing bulk micromachining process
MP26 - VTI 3D-MEMS with CSOI
MP27 - SensorDynamics PSM-X2 process
MP41 - Freescale CMOS/MEMS process
MP42 - Bosch APSM process
MP43 - Sensonor bulk micromachining process
MP44 - Denso bulk micromachining process
MP45 - Infineon CMOS/MEMS process
MP51 - Knowles SiSonic MEMS process
MP52 - Omron micromachining process
MP53 - Analog Devices micromachining process
MP54 - Akustica CMOS/MEMS process
MP61 - SiTime MEMS First process
MP62 - Discera micromachining / Silex Microsystems TSI process
MP71 - Texas Instruments DLP process
MP81 - HP inkjet head process
For more information about our company, specific custom analysis or reports, please feel free to contact us
Yole Développement Headquarter, France:
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