QinetiQ and Yole Développement have edited a new report describing the current applications, market and technology trends for integrated MEMS. The MEMS business is currently under strong re-organization. Since the last few years, there has been a strong involvement of IC manufacturers to find new opportunities in the MEMS business, especially for large volume markets like
- Automotive with inertial MEMS,
- IT with micro-mirrors
- Telecommunications with RF MEMS…
Furthermore, many IC players have made large investments (STM, Infineon, Motorola, Fairchild, Dalsa Semiconductor, Semefab, Elmos, X-Fab …). Integrated MEMS market share is expected to grow in the future. However there are today still bottlenecks to be overcame (process standardization, MEMS is not always a large volume market …).
Today, there is an increasing use of MEMS-on-IC processes. There are many motivations for selecting monolithic integration as a solution: cost advantages, commercial imperatives, performance advantages or pragmatism… Nevertheless, hybrid solutions are still sometimes preferred as it offers distinct advantages (more flexible manufacturing strategy, shorter development time, simpler and more easily available manufacturing process …).
The MEMSonIC report gives an in-depth overview of the current status of IC and MEMS integration technologies presenting its advantages, its cost analysis and its bottlenecks.
The report will also compare the different process lines (surface micromachining, SOI HARM …) and key characteristics of MEMS and IC lines.
For the first time, a cost analysis will show when there is an advantage for an integrated solution.
Different parameters such as MEMS and MOS area, above or beside CMOS process, packaging cost, volume … are considered.
A business analysis is also provided with description of the applications in terms of use for integrated MEMS and in terms of market evaluation per application for 2003 - 2007 (Figure 3). The MEMS on IC technologies are taking a very important market share compared to total MEMS activities.
Products like Digital Mirror Displays (from TI), tyre pressure sensors… are using MEMS on IC processes in order to have cost and function competitiveness. The QinetiQ/Yole Développement report also describes for the first time the Top 30 MEMS manufacturers worldwide
It includes a detailed analysis of the different companies, the manufacturing facilities, and the alliances and products portfolio.
The MEMSonIC report highlights the main motivations for MEMS on IC integration, the status of IC and MEMS integration, a comparison of process lines, a technology analysis (who is doing what), a description of the applications for MEMS integrated with IC, a market evaluation, an analysis of the different business models … The report also presents detailed profiles of the MEMS manufacturers doing integrated MEMS worldwide, presenting the manufacturing facilities, major contacts per company and key data on each company.
Company profiles included in the report:
Analog Devices, Bosch, Colibrys, Dalsa, Fairchild, HP, Infineon, MEMSiC, Micralyne, Motorola, QinetiQ, STM, TSMC, VTI Hamlin, X Fab…
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QinetiQ and Yole Développement have edited a report describing the current applications, market and technology trends for integrated MEMS.