Physical Analysis of the Wafer-Level Camera
Step by Step Reconstruction of the Process Flow
 Cost of Manufacturing and Estimation of Selling Price

Yole Développement is proud to publish the reverse costing report of the wafer-level camera supplied by Nemotek Technologie for portable applications.

The camera is built using a wafer-level packaged CMOS image sensor and wafer-level optics. Both technologies are licensed by Tessera. The wafer-level packaging of the CIS is realized with the Shellcase® MVP process, using TSVs to connect the bond pads on the die and the BGA interface on the rear face of the package. The wafer-level optics is a single lens element, reflow compatible, manufactured with the OptiML™ WL-Optics process.

The wafer-level camera is entirely assembled by Nemotek Technologie in Morocco.

This report provides complete teardown of the camera module with:

•  Detailed photos
•  Material analysis
•  Schematic assembly description
•  Manufacturing Process Flow
•  In-depth economical analysis
•  Manufacturing cost breakdown
•  Selling price estimation

TABLE OF CONTENTS (~90 pages)

• Glossary
  • Overview/Introduction
  • Executive Summary
•  Reverse Costing Methodology
  • Companies Profiles
  •  Nemotek Technologie Profile
•  Tessera Profile
• Physical Analysis
  •  Synthesis of the Physical Analysis
  •  Physical Analysis Methodology
  •  Camera Module Views & Dimensions
  •  Camera Module X-Ray
  •  Camera Module Disassembly
  •  CIS Views & Dimensions
  •  Camera Module Cross-section
  •  Optical Module Cross-section
  •  Top FR-4 wafer cross-section
  •  Lenses wafer cross-section
  •  Spacer FR-4 wafer cross-section
  •  Wafer-Level Packaging Cross-section
  •  Glass carrier cross-section
  •  TSV cross-section
  •  Solder bump cross-section
  •  Physical Data Summary
  • Manufacturing Process Flow
  •  CIS Wafer-level packaging Process Flow
  •  WL-Optics Process Flow
  •  Description of the Wafers Fabrication Unit
• Cost Analysis
  •  Main Steps of Economic Analysis
  •  Yields Hypotheses
  •  CIS Front-End : Hypotheses
  •  CIS WLP Cost
  •  CIS WLP Cost per Process Steps
  •  CIS WLP : Equipment Cost per Family
  •  CIS WLP : Material Cost per Family
  •  CIS WLP : Test & Dicing
  •  CIS WLP Die Cost
  •  WL-Optics Cost
  •  WL-Optics Cost per Process Steps 
  •  WL-Optics : Equipment Cost per Family
  •  WL-Optics : Material Cost per Family
  •  WL-Optics : Test & Dicing
  •  WL-Optics Die Cost
  •  Back-End : Assembly, Housing & Final Test
  •  Camera Module Assembly Cost (WLP + WLO + Test)
• Estimated Price Analysis
• Conclusion