Yole Développement is proud to publish the reverse costing report of the VGA Camera Module supplied by ST Microelectronics for the Nokia 2330 mobile phone.
This camera module integrates an 2.2µm pixel CMOS Image Sensor (CIS) from STMicro. The CIS die is manufactured using a CMOS technology with a 0.18µm process.
The CIS is Wafer-Level Packaged (WLP) using a TSV "via last" technology.
The optical module comes from Heptagon and is manufactured with a wafer-level approach.
This report provides complete teardown of the camera module with:
TABLE OF CONTENTS (~110 pages)
Nokia 2330 Teardown
Manufacturing Process Flow
Estimated Price Analysis