Yole Developpement is proud to publish the reverse costing report of the OSLON SSL Ultra White LED supplied by OSRAM. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

• The Oslon SSL ultra white series have a typical brightness of 100lm with a consumption of 1.12W at 350mA.
• The component is provided in a specific 2-pins package, compatible with SMT process.
• It can be used in a wide range of lighting applications, including: Residential retrofits & fixtures, Spot lights, Task lights, Accent lights, Professional downlights and Shop lighting. This report provides complete teardown of the LED with:

1. Detailed photos
2. Material analysis
3. Schematic assembly description
4. Manufacturing Process Flow
5. In-depth economical analysis
6. Manufacturing cost breakdown
7. Selling price estimation

• Analyze the cost of projects at the R&D level
• Enhance the negotiation power of purchasing managers
• Benchmark competitor’s products

Glossary                                                                             p3

1. Overview / Introduction                                                  p4

• Executive Summary
• Comparison of the analyzed LEDs
• Reverse Costing Methodology 

2. Physical Analysis                                                          p8

• Physical Analysis Methodology
• Package Characteristics
• Package X-Ray
• Package Opening
• Package Cross-Section
• Fluorescent Material
• Package Parameters Summary
• LED Dimensions
• LED Emission
• LED Cross-Section
• LED Structure

3. Manufacturing Process Flow                                       p31

• LED Die Process Flow
• Description of the Wafer Fabrication Unit

 4. Cost Analysis                                                                p37

• Synthesis of the Cost Analysis
• Yields Explanation
• LED Front-End Cost
• Front-End : Epitaxy Cost
• Front-End : Other Front-End Cost
• Dies per Wafer & Probe Test
• Back-End 0 : Probe Cost
• Back-End 0 : Dicing Cost
• LED Wafer & Die Cost (FE + BE 0)
• Back-End 1 : Packaging Process Flow
• Back-End 1 : Final Test Cost
• Component Manufacturing Cost (FE+BE0+BE1)
• Cost Analysis Evolution

5. Estimated Manufacturer Price Analysis                    p63

• Price definitions
• Manufacturers financial ratios
• Binning Impact on Manufacturing Price
• Ideal manufacturer Price
• Manufacturing Price with Binning Yield

Conclusion                                                                        p70