> Teardowns & Reverse Costing Analysis
LED : Osram - Platinum Dragon LED
 Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price
PRICE (Multi user license) : 4190 €
Publication date : 4 November 2010
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Developpement is proud to publish the reverse costing report of the Platinum Dragon LED series (ref: LW W5SN) from OSRAM. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.
•The Platinum Dragon series is round type and consumes 0.5 watt at 150mA. A typical luminous flux is 90lm at 350mA and up to 190lm at 1A.
•The component is provided in a specific 2-pins 7x6mm package.
•It is used in various applications such as exterior and interior automotive lighting, flashlight, backlighting, reading lamps, substitution of micro incandescent lamps, indoor and outdoor lighting. This report provides complete teardown of the LED with:
• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation
Glossary
1. Overview / Introduction
• Executive Summary
• Comparison of the analyzed LEDs
• Reverse Costing Methodology
2. Physical Analysis
• Physical Analysis Methodology
• Package Characteristics
• Package X-Ray
• Package Opening
• Package Cross-Section
• Fluorescent Material
• Package Parameters Summary
• LED Dimensions
• LED Emission
• LED Cross-Section
• LED Structure
3. Manufacturing Process Flow
• LED Die Process Flow
• Description of the Wafer Fabrication Unit
4. Cost Analysis
• Synthesis of the Cost Analysis
• Yields Explanation
• LED Front-End Cost
• Front-End : Epitaxy Cost
• Front-End : Other Front-End Cost
• Dies per Wafer & Probe Test
• Back-End 0 : Probe Cost
• Back-End 0 : Dicing Cost
• LED Wafer & Die Cost (FE + BE 0)
• Back-End 1 : Packaging Process Flow
• Back-End 1 : Final Test Cost
• Component Manufacturing Cost (FE+BE0+BE1)
• Cost Analysis Evolution
5. Estimated Manufacturer Price Analysis
• Price definitions
• Manufacturers financial ratios
• Binning Impact on Manufacturing Price
• Ideal manufacturer Price
• Manufacturing Price with Binning Yield
Conclusion
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