Glossary ………………………..………………….…...…3
1. Overview / Introduction……………………….…...…4
- Executive Summary
- Comparison of the Analyzed LEDs
- Reverse Costing Methodology
- GW5BTF27K00
2. Physical Analysis………………………………...……8
- About the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics / Package X-Ray / Package Connection
- Dam and Fill
- Phosphor
- LEDs in the package
- Package synthesis
- Semiconductor Die
- Patterned Sapphire Substrate
- Epitaxial Structure
- Structure
- Passivation
- Cathode
- Anode
- Active Layers – GaN die
- Blue LED Structure
3. Manufacturing Process Flow…………….…………36
- LED Die Process Flow
- Description of the Wafer Fabrication Units
4. Cost Analysis……………………………………………..…..41
- Synthesis of the Cost Analysis
- Yields Explanation
- Yield Hypotheses
- LED Front-End Cost
- Front-End : Epitaxy Hypotheses
- Front-End : Epitaxy Cost / Cost per Steps
- Front-End : Other Front-End Cost
- Front-End : Other Front-End Cost per Steps
- Front-End Cost per Equipment Family
- Front-End Cost per Consumable Family
- Dies per Wafer & Probe Test
- Back-End 0 : Probe Cost
- Back-End 0 : Dicing Cost
- LED Wafer & Die Cost (FE + BE 0)
- Back-End 1 : Packaging Hypothesis
- Back-End 1 : Packaging Process Flow / Packaging Cost Details
- Back-End 1 : Final Test Cost
- Component Manufacturing Cost (FE+BE0+BE1)
- Cost Analysis Evolution
5. Estimated Manufacturer Price Analysis …………………62
- Price definitions
- Manufacturers financial ratios
- Binning Impact on Manufacturing Price
- Ideal manufacturer Price
- Manufacturing Price with Binning Yield
Conclusion ………………………………………………………68